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Blind Buried Via TG150 FR4 Printed Circuit Board Copper Clad PCB Design

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Blind Buried Via TG150 FR4 Printed Circuit Board Copper Clad PCB Design

Blind Buried Via TG150 FR4 Printed Circuit Board Copper Clad PCB Design
Blind Buried Via TG150 FR4 Printed Circuit Board Copper Clad PCB Design Blind Buried Via TG150 FR4 Printed Circuit Board Copper Clad PCB Design

Large Image :  Blind Buried Via TG150 FR4 Printed Circuit Board Copper Clad PCB Design Get Best Price

Product Details:

Place of Origin: China
Brand Name: Found
Certification: UL E361831
Model Number: FD-117

Payment & Shipping Terms:

Minimum Order Quantity: 1 pcs
Price: negotiable
Packaging Details: Vacuum Packing
Delivery Time: 5-8 work days
Payment Terms: T/T
Supply Ability: 10 000
Detailed Product Description
Base Material: Aluminium,PCB Circuit Board Surface Finishing: Immersion Gold
Product Name: Printed Circuit Board,Multilayer PCB Application: Consumer Electronics,Electronics Device
Type: Electronic Board,Customizable Color: Green/Blue/Red/White/Yellow/Black/Matt Black
Usage: Electronic Products
High Light:

fr4 double sided pcb

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fr4 copper clad sheet

Blind Buried Via TG150 FR4 Printed Circuit Board Copper Clad PCB Design

Base Material FR-4 High TG
Copper Thickness 1 oz
Board Thickness 1.6 mm
Min. Hole Size 6 mil
Min. Line Width 3 mil
Min. Line Spacing 3 mil
Mounting Production 6 SMT Lines
  • Product Details

Blind Buried Via TG150 FR4 Printed Circuit Board Copper Clad PCB Design 0

General profile
The buried via is the hole made between inner layers used to interconnect the inner layer signal. It can not be visible from surface layers of top and bottom layer. Generally, they're often used on the mobile phone,PDA board etc.
Advantages
A) Reduce the probability of signal interference;
B) Keep the continuity of the characteristic impedance of the transmission line;
C) Save wiring space, suitable for high density and high speed circuit board design;
Application
Blind Buried Via TG150 PCB is applied for mobile phone, PDA boards, telecommunications, complext modules.

Serial NO. Procedure Item Manufacturing capability
Large volume (S<100 m) Middle volume(S<10 m) Prototype(S<1m)
1 Inner layer(18um, 35um, 70um etc are finished copper. If not mentioned copper, finished 1oz is the default value ) Min.isolation of layers 0.1mm 0.1mm 0.06mm
2 Min.track and spacing 5/5mil(18um) 4/4mil(18um) 3/3.5mil(18um)
3 5/5mil(35um) 4/4mil(35um) 3/4mil(35um)
4 7/9mil(70um) 6/8mil(70um) 6/7mil(70um)
5 9/11mil(105um) 8/10mil(105um) 8/9mil(105um)
6 13/13mil(140um) 12/12mil(140um) 12/11mil(140um)
7 Min.distance from drill to conductor 4 Layer 10mil,6 layer 10mil,8-12 layer 12mil 4 layer 8mil,6 layer 8mil,8-12 layer 10mil,14-20 layer 14mil,22-32 layer 18mil 4 layer 6mil,6 layer 6mil,8-14 layer 8mil,16-22 layer 12mil,24-32 layer 14mil
8 Min.width of annular ring on inner layer 4 Layer 10mil(35um),≥6 Layer 14mil(35um) 4 Layer 8mil(35um),≥6 layer 12mil(35um) 4 Layer 6mil(35um),≥6 Layer 10mil(35um)
9 Inner layer isolation ring width(Min) 10mil (35um) 8mil (35um) 6mil (35um)
10 Min.via pad diameter 20mil (35um) 16mil (35um) 16mil (35um)
11 Min. distance from board edge to conductor(no copper exposured)(inner layer) 14 mil(35um) 12 mil(35um)) 8 mil(35um)
12 Maximum copper weight(Inner layer and outer layer) 3 OZ( 105 um )  

advantage:

Over 10 years' manufacturing experience
Assembly provided
100% quality tested before shipment
Certificate of UL, ISO9001, ISO14001 and ISO/TS16949.
Our Products meet the RoHS & WEEE lead-free requirement.
Small Order accepted
3 weeks for massive production; 10 days for sample since material prepared
Urgent case or spread delivery schedule will be updated per negociation then

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Shenzhen Found Printed Circuit Board Co., Ltd.

Contact Person: Lois

Tel: +8613477497317

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