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Flex Rigidhigh Heat Conducting Metal PCB Printed Board flex pcb design

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Flex Rigidhigh Heat Conducting Metal PCB Printed Board flex pcb design

Flex Rigidhigh Heat Conducting Metal PCB Printed Board flex pcb design
Flex Rigidhigh Heat Conducting Metal PCB Printed Board flex pcb design Flex Rigidhigh Heat Conducting Metal PCB Printed Board flex pcb design

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Product Details:

Place of Origin: China
Brand Name: Found
Certification: UL:E361831
Model Number: Found91

Payment & Shipping Terms:

Minimum Order Quantity: 1PC
Price: Negotiatable
Packaging Details: vacuum packing
Delivery Time: 2-8 days
Payment Terms: T/T
Supply Ability: 100000PC
Detailed Product Description
Base Material: FR-4, PI, FR-4/aluminum/ceramic, CEM-1 OR FR-4, Aluminium Board Thickness: 1.6mm, 1.6mm-3.2mm, 0.2-6.0mm, 0.2--6mm, 0.4-2.4 Mm
Product Name: Printed Circuit Board, Pcb Board Assembly, One Stop Service Manufacturer Pcb Circuit Boards Flexible, Pcb Assembly Led, Tooling 26$ SMT Flexible Small Printed Pcb Circuit Boards Application: Consumer Electronics, Electronics Device, Tablet, Mobile, Pcb Circuit Boards Flexible
Material: FR4 CEM1 CEM3 Hight TG, FR4/ROGERS/PET/HDI/CEM/PI, Polyimide Type: Electronic Board, Customizable, Electronic PCB Assembly, Pcb Copy Service, Electronics Device
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Flex Rigidhigh Heat Conducting Metal PCB Printed Board flex pcb design

PCB DescriptionOur PCB Board Capability
PCB Surface Finisheselectrolytic nickel-gold,
HASL(Lead Free, ENIG (Electroless Nickel/Immersion Gold, Carbon Ink, Golden Fingers, OSP (Entek, Immersion Tin, Immersion Silver
PCB Max. Size1200mm×600mm
PCB Min. Size5mm×5 mm
Bow & Twist ToleranceSingle Side≤1.0%,Double Side≤0.7%, Muti-Layer≤0.5%
Min. Board Thickness & Tolerance0.2mm±0.08mm
PCB Min. trace/spacingTin board:0.2mm±20%(8mil±0%)
gold board:0.075mm±20%(3mil±0%)
Copper to Board Edge Spacing0.5mm(20mil)
Hole to Trace Spacing0.3mm(12mil)
Min. Hole Diameter0.2mm±.076mm(8mil±3mil)
Min. Hole Clearance0.4mm±.076mm(16mil±3mil)
Copper Thickness on Hole Wall20-25um(0.79mil-1.0mil)
Hole Location Tolerance±0.076mm(l±3mil)
Min Diameter of Punching HoleFR-4 board thickness≤1.0mm(40mil):1.0mm(40mil)
FR-4 board thickness 1.2-3.0mm(48-120mil):1.5mm(60mil)
PCB Min. Punching SlotFR-4 CEM-3 board thickness≤1. 0mm(40mil):0.8 mm×0.8 mm(32mil×32mil)
FR-4 board thickness1.2-3.0mm(48-120mil): 1.0 mm×1.0 mm(40mil×40mil)
Trace width variation±0.076mm(±3mil)
Outline ToleranceRouting:±0.1mm (±4mil) ,Punching:±0.05mm (±2mil)
V-CUT Registration Tolerance±0.2mm (±8mil)
PCB BOARD TypeSingle-sided, double-sided, multi-layer
Major MaterialFR-4, CEM-1,CEM-3, high frequency laminates, Aluminum, NiFe-based, copper base
PCB BOARD Thickness0.2-3.5mm
Base Copper Thickness11um 35um 70um 105um
Max. aspect ratio(board thickness: hole size)8:1
V-Cut Angle Tolerance±5°
V-Cut Board Thickness0.4mm -3.2mm(16mil -128mil)
Min SMT Pitch0.3mm(12mil)
Min. Component mark0.15mm(6mil)
Min. width of annular ring(finished)0.15mm(6mil)/side
Min pad opening0.076mm(3mil)
Min S/M Bridge±0.076mm(±3mil)
carbon ink board manufacturing capability:1.Impedance Control:20K±10% 2.Hardness:6H 3.bearable friction times :above 200000 times
 Min trace/space(inner/external)3/3 mil0.075/0.075mm 
 Min drill size for through holedrill 8.0 mil0.20mm 
 Laser dill4 mil0.1mm 
 Copper Foil Thickness17-210um 
 Inner Core Thickness±0.08mm 
 Tolerance of total board thickness±0.015mm 
 Max .Unit Area700-800 
 Min. Unit Area2-5mm 
 Max Layer1-18 Layers 
 Surface Treatment  
 Solder Coating Thickness Sn4-20um 
 Cobalt/ Gold plating, Hard Gold ThicknessNi:5-10umAu:0.05-0.20um 
 Gold/Nickel Plating ThicknessNi:5-10umAu:0.05-0.15um 
 OSP Coating Thickness0.2-0.5um 
 Electroness Au ThicknessNi:3-15umAu:0.025-0.10mm 
 Chem .Tin ThicknessSn:0.8-5um 
 Producting Capacityeach day :800-100m2 
 Aspect Ratio6:01:00 
 Hole Registration0.004" (0.1mm) 

Flex Rigidhigh Heat Conducting Metal PCB Printed Board flex pcb design 0


Product Details

Single-sided FPC has a layer of chemically etched conductive pattern, and the conductive pattern layer on the surface of the flexible insulating substrate is a rolled copper foil. The insulating substrate could be aramid fiber, polyethylene terephthalate, polyimide and polyvinyl chloride. Single-layer flexible PCB can be divided into the following four sub-categories:
1). Single-sided connection without covering layer
The conductive pattern is on the insulating substrate, the surface of leads is without covering layer, they are interconnected by soldering, welding or pressure welding. This FPC is commonly used in the early telephone.
2). Single-sided connection with covering layer
Comparing to the above FPC, this kind of FPC is with a covering layer on the surface of the lead. What is worth noting is, the pads need to be exposed when covering, the terminal area could be free of covering if permits. This kind of single-sided FPC is the most widely used and normally applied to automotive instrumentation, electronic equipment.
3). Double-sided connection without covering layer
The connecting pad could be connectable whether on the front side or back side of the lead. A via hole is formed on the insulating substrate around the pad by stamping, etching or other mechanical methods.
4). Double-sided connection with covering layer
Unlike the last type of double-sided FPC, the surface of this type of FPC has a covering layer with vias that allow it to be terminated on both sides and still retain the covering layer, it is made of two layers of insulating material and a layer of metal conductor.

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