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FR4 Printed Circuit Board Material Data Sheet , Printed Circuit Board Assembly

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FR4 Printed Circuit Board Material Data Sheet , Printed Circuit Board Assembly

FR4 Printed Circuit Board Material Data Sheet ,  Printed Circuit Board Assembly
FR4 Printed Circuit Board Material Data Sheet ,  Printed Circuit Board Assembly FR4 Printed Circuit Board Material Data Sheet ,  Printed Circuit Board Assembly

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Product Details:

Place of Origin: China
Brand Name: Found
Certification: UL:E361831
Model Number: Found159

Payment & Shipping Terms:

Minimum Order Quantity: 1PC
Price: Negotiatable
Packaging Details: Vacuum packing
Delivery Time: 2-8 days
Payment Terms: T/T
Supply Ability: 100000PC
Detailed Product Description
Copper Thickness: 1oz,1/2OZ 1OZ 2OZ 3OZ,1 Oz,2oz,1.5oz Base Material: FR-4,CEM-1,Aluminium,PCB Circuit Board,FR-4/Cluminum/Ceramic/CEM-3/RF-1
Min. Line Spacing: 0.1mm4mil),0.003",4mil,0.1mm,0.075mm =3mil Board Thickness: 1.6mm,1.6mm-3.2mm,0.8mm,0.3~2.5mm
Min. Line Width: 3mi,4mil,0.1mm,0.1 0mm,0.075mm/0.075mm(3mil/3mil) Min. Hole Size: 0.20mm,0.1mm,4mil-laser Drill,6mil,0.004"
Surface Finishing: HASL,Immersion Gold,OSP,HASL Lead Free,ENIG Product Name: Printed Circuit Board,Multilayer PCB,fr4 Double Sided Pcb Smt Assembly Motor Control Board,pcba Assembly
High Light:

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fr4 pcb material data sheet or printed circuit board assembly
 

PCB DescriptionOur PCB Board Capability
PCB Surface Finisheselectrolytic nickel-gold,
HASL(Lead Free, ENIG (Electroless Nickel/Immersion Gold, Carbon Ink, Golden Fingers, OSP (Entek, Immersion Tin, Immersion Silver
PCB Max. Size1200mm×600mm
PCB Min. Size5mm×5 mm
Bow & Twist ToleranceSingle Side≤1.0%,Double Side≤0.7%, Muti-Layer≤0.5%
Min. Board Thickness & Tolerance0.2mm±0.08mm
PCB Min. trace/spacingTin board:0.2mm±20%(8mil±0%)
gold board:0.075mm±20%(3mil±0%)
Copper to Board Edge Spacing0.5mm(20mil)
Hole to Trace Spacing0.3mm(12mil)
Min. Hole Diameter0.2mm±.076mm(8mil±3mil)
Min. Hole Clearance0.4mm±.076mm(16mil±3mil)
Copper Thickness on Hole Wall20-25um(0.79mil-1.0mil)
Hole Location Tolerance±0.076mm(l±3mil)
Min Diameter of Punching HoleFR-4 board thickness≤1.0mm(40mil):1.0mm(40mil)
FR-4 board thickness 1.2-3.0mm(48-120mil):1.5mm(60mil)
PCB Min. Punching SlotFR-4 CEM-3 board thickness≤1. 0mm(40mil):0.8 mm×0.8 mm(32mil×32mil)
FR-4 board thickness1.2-3.0mm(48-120mil): 1.0 mm×1.0 mm(40mil×40mil)
Trace width variation±0.076mm(±3mil)
Outline ToleranceRouting:±0.1mm (±4mil) ,Punching:±0.05mm (±2mil)
V-CUT Registration Tolerance±0.2mm (±8mil)
PCB BOARD TypeSingle-sided, double-sided, multi-layer
Major MaterialFR-4, CEM-1,CEM-3, high frequency laminates, Aluminum, NiFe-based, copper base
PCB BOARD Thickness0.2-3.5mm
Base Copper Thickness11um 35um 70um 105um
Max. aspect ratio(board thickness: hole size)8:1
V-Cut Angle Tolerance±5°
V-Cut Board Thickness0.4mm -3.2mm(16mil -128mil)
Min SMT Pitch0.3mm(12mil)
Min. Component mark0.15mm(6mil)
Min. width of annular ring(finished)0.15mm(6mil)/side
Min pad opening0.076mm(3mil)
Min S/M Bridge±0.076mm(±3mil)
carbon ink board manufacturing capability:1.Impedance Control:20K±10% 2.Hardness:6H 3.bearable friction times :above 200000 times
 Technology  
 Min trace/space(inner/external)3/3 mil0.075/0.075mm 
 Min drill size for through holedrill 8.0 mil0.20mm 
 Laser dill4 mil0.1mm 
 Copper Foil Thickness17-210um 
 Inner Core Thickness±0.08mm 
 Tolerance of total board thickness±0.015mm 
 Max .Unit Area700-800 
 Min. Unit Area2-5mm 
 Max Layer1-18 Layers 
 Surface Treatment  
 Solder Coating Thickness Sn4-20um 
 Cobalt/ Gold plating, Hard Gold ThicknessNi:5-10umAu:0.05-0.20um 
 Gold/Nickel Plating ThicknessNi:5-10umAu:0.05-0.15um 
 OSP Coating Thickness0.2-0.5um 
 Electroness Au ThicknessNi:3-15umAu:0.025-0.10mm 
 Chem .Tin ThicknessSn:0.8-5um 
 Producting Capacityeach day :800-100m2 
 Aspect Ratio6:01:00 
 Hole Registration0.004" (0.1mm) 

 
FR4 Printed Circuit Board Material Data Sheet ,  Printed Circuit Board Assembly 0
 
Features and benefits
1. The dielectric constant (DK) is low and stable, so the signal transmission is good without delay.
2. The characteristic of low dielectric loss makes the signal loss at a lower level, which makes the signal
transmission of the whole equipment excellent.
3. Delamination of copper foil will not be caused by the change of cold and heat due to the consistency
with the thermal expansion coefficient of copper foil.
4. Immersion gold has excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.
5. UL, ISO certified PCB manufacturing factory.
6. Make delivery on time keeping 98% on-time-delivery rate.
7. Eligible products rate of first production: >95%
8. Experienced sales persons provide skilled customer services.
9. Fast and flexible to save the time of production from prototype to standard production
 
Trade Terms:
1. Payment: T/T in advance (Western Union , payple is welcomed)
2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.
3. Sample can be delivered in 3days
4. Shipping freight are quoted under your requests
5. Shipping port: Shen zhen,Mainland China
6. Discounts are offered based on order quantities
7. MOQ: 1PCS
Package &Shipping Methods:
1.Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement

 
 
Application
High Frequency Singer Board PCB is applied to Touch screen, LED display soft board,Tablet antenna soft board.
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Contact Details
Shenzhen Found Printed Circuit Board Co., Ltd.

Contact Person: Lottie

Tel: +8615826676756

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