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Green Gold Finger 3OZ FR4 Printed Circuit Board PCB Assembly Design

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Green Gold Finger 3OZ FR4 Printed Circuit Board PCB Assembly Design

Green Gold Finger 3OZ FR4 Printed Circuit Board PCB Assembly Design
Green Gold Finger 3OZ FR4 Printed Circuit Board PCB Assembly Design Green Gold Finger 3OZ FR4 Printed Circuit Board PCB Assembly Design

Large Image :  Green Gold Finger 3OZ FR4 Printed Circuit Board PCB Assembly Design Get Best Price

Product Details:

Place of Origin: China
Brand Name: Found
Certification: UL E361831
Model Number: FD-120

Payment & Shipping Terms:

Minimum Order Quantity: 1 pcs
Price: negotiable
Packaging Details: Vacuum Packing
Delivery Time: 5-8 work days
Payment Terms: T/T
Supply Ability: 10 000
Detailed Product Description
Base Material: Aluminium,PCB Circuit Board Product Name: Printed Circuit Board,fr4 Double Sided Pcb Smt Assembly Motor Control Board
Application: Consumer Electronics Type: Customizable
Material: KB Class A Laminate FR4 Item: Litcoin Miner Machine,Custom Circuit Board
High Light:

fr4 double sided pcb

,

fr4 copper clad sheet

Green Gold Finger 3OZ FR4 Printed Circuit Board PCB Assembly Design

Dimensions 178.04 x 47.06mm
Line width/space 0.2mm/0.2mm
Base materials 1.4mil Cu/0.8mil ADH/1mil PI, 1.4mil Cu/1.2mm FR4
Cover layer 1mil ADH/1mil PI green oil
Surface treatment (Au: 0.03 to 0.09um, Ni: 2 to 6um)
Outline tolerance ±0.2mm
Cover layer tolerance ±0.3mm
  • Product Details

Product Pictures

Green Gold Finger 3OZ FR4 Printed Circuit Board PCB Assembly Design 0

Product Parameters

Main Technique Index
Description Parameters
Polyimide Polyester
Base film Thickness (um) 12.5,25,35,50 12.5,25,35,50
Copper Thickness (um) 12,17.5,35,50,70,105
Min. Line Width/Line Space (mm) 0.075/0.075
Min. Hole Size (mm) 0.15
Tolerance (mm) Outline:+/-0.05; Coverlay: +/-0.2
Peel Strength (kgf/cm) Above 1.0 Above 0.8
Solder Resistance 260C 10 seconds 204C 5 seconds
     
Surface Treatment
Content Normal coating thickness Normal PNL size
Plating nickel gold (In house) Ni:2-9um;Au:0.03-0.09um 300mm×400 MM
Plating hard gold (In house) Ni:2-9um;Au:0.1-1.0um 300mm×400 MM
Plating soft gold (In house) Ni:2-9um;Au:0.03-0.09um 300mm×400 MM
Plating pure tin (In house) 2.0-8.0um 300mm×400 MM
Immersion Tin (In house) 0.3-0.6um 300mm×400 MM
OSP (In house) N/A 300mm×400 MM
ENIG (Hard Nickel) (In house) Ni:2-6um;Au:0.03-0.10um 300mm×400 MM
ENIG (Soft Nickel) (In house) Ni:2-6um;Au:0.03-0.10um 300mm×400 MM
ENEPIG (Hard Nickel) (In house) Ni:2-6um;Au:0.03-0.10um 300mm×400 MM
HASL (Outsource) Cover the pads with min thickness 1~2 um 300mm×400 MM
Immersion silver (Outsource) Per standand creteria 300mm×400 MM

Advantages:
1. Reduce contact resistance
2. Movable termination becomes convenient
3. Beautiful appearance

Bevelling of gold finger

Bevel angle (°)

PCB thickness (mm)

Remaining thickness (mm)

Bevel depth (mm)

20°

1.6

0.5

1.51

2.0

0.65

1.85

2.4

0.7

2.34

30°

1.6

0.5

0.95

2.0

0.65

1.16

2.4

0.7

1.47

45°

1.6

0.5

0.5

2.0

0.65

0.65

2.4

0.7

0.7

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Shenzhen Found Printed Circuit Board Co., Ltd.

Contact Person: Lois

Tel: +8613477497317

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