Shenzhen Found Printed Circuit Board Co., Ltd.

 

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Main Printed Circuit Board for SMT Stencil High Frequency PCB

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China Shenzhen Found Printed Circuit Board Co., Ltd. certifications
China Shenzhen Found Printed Circuit Board Co., Ltd. certifications
The delivery time is quick, and very important: the products always sent match the order. I trust them because i've never been disapointed with them.

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Please develop more nice PCB Boards and with better prices, so we can sell your machines to more clients and gain larger markets. Thanks you

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Main Printed Circuit Board for SMT Stencil High Frequency PCB

Main Printed Circuit Board for SMT Stencil High Frequency PCB
Main Printed Circuit Board for SMT Stencil High Frequency PCB Main Printed Circuit Board for SMT Stencil High Frequency PCB

Large Image :  Main Printed Circuit Board for SMT Stencil High Frequency PCB Get Best Price

Product Details:

Place of Origin: China
Brand Name: Found
Certification: UL E361831 ISO9001 TS16949
Model Number: fd99

Payment & Shipping Terms:

Minimum Order Quantity: 1PC
Price: Negotiable
Packaging Details: Vacuum Packing
Delivery Time: 2-8 days
Payment Terms: T/T
Supply Ability: 100000PC
Detailed Product Description
Copper Thickness: 1oz Base Material: CEM-1
Min. Line Spacing: 0.003" Board Thickness: 1.6mm-3.2mm
Min. Line Width: 0.1mm Min. Hole Size: 4mil-laser Drill
Surface Finishing: Immersion Gold Product Name: Printed Circuit Board
Application: Consumer Electronics Type: Electronic Board
Solder Mask: Green/Blue/Black/Red Material: KB Class A Laminate FR4
Color: Blue On Your Request Solder Mask Color: Green Black Red
Service: One-stop Service Usage: Lithium Battery Packs
Layers: 1-28 L Item: Litcoin Miner Machine
High Light:

fr4 double sided pcb

,

fr4 copper clad sheet

Main Printed Circuit Board for SMT Stencil High Frequency PCB

Main Printed Circuit Board for SMT Stencil High Frequency PCB 0

 

 

Pls see our pcb catalog below:
1. single side pcb 2. double side pcb
3. Multilayer pcb(3-26+ layers) 4. Flexible PCB(FPC)
5. Rigid-flex PCB board 6. Aluminum PCB board for LED(1-4 layers)
7. MCPCB board (1-4 layers) 8.Ceramic PCB(1-4 layers)
9. HDI pcb board 10. High frequency PCB
11. PCB assembly

PCB Description Our PCB Board Capability
PCB Surface Finishes electrolytic nickel-gold,
HASL(Lead Free, ENIG (Electroless Nickel/Immersion Gold, Carbon Ink, Golden Fingers, OSP (Entek, Immersion Tin, Immersion Silver
PCB Max. Size 1200mm×600mm
PCB Min. Size 5mm×5 mm
Bow & Twist Tolerance Single Side≤1.0%,Double Side≤0.7%, Muti-Layer≤0.5%
Min. Board Thickness & Tolerance 0.2mm±0.08mm
PCB Min. trace/spacing Tin board:0.2mm±20%(8mil±0%)
gold board:0.075mm±20%(3mil±0%)
Copper to Board Edge Spacing 0.5mm(20mil)
Hole to Trace Spacing 0.3mm(12mil)
Min. Hole Diameter 0.2mm±.076mm(8mil±3mil)
Min. Hole Clearance 0.4mm±.076mm(16mil±3mil)
Copper Thickness on Hole Wall 20-25um(0.79mil-1.0mil)
Hole Location Tolerance ±0.076mm(l±3mil)
Min Diameter of Punching Hole FR-4 board thickness≤1.0mm(40mil):1.0mm(40mil)
FR-4 board thickness 1.2-3.0mm(48-120mil):1.5mm(60mil)
PCB Min. Punching Slot FR-4 CEM-3 board thickness≤1. 0mm(40mil):0.8 mm×0.8 mm(32mil×32mil)
FR-4 board thickness1.2-3.0mm(48-120mil): 1.0 mm×1.0 mm(40mil×40mil)
Trace width variation ±0.076mm(±3mil)
Outline Tolerance Routing:±0.1mm (±4mil) ,Punching:±0.05mm (±2mil)
V-CUT Registration Tolerance±0.2mm (±8mil)
PCB BOARD Type Single-sided, double-sided, multi-layer
Major Material FR-4, CEM-1,CEM-3, high frequency laminates, Aluminum, NiFe-based, copper base
PCB BOARD Thickness 0.2-3.5mm
Base Copper Thickness 11um 35um 70um 105um
Max. aspect ratio(board thickness: hole size) 8:1
V-Cut Angle Tolerance ±5°
V-Cut Board Thickness 0.4mm -3.2mm(16mil -128mil)
Min SMT Pitch 0.3mm(12mil)
Min. Component mark 0.15mm(6mil)
Min. width of annular ring(finished) 0.15mm(6mil)/side
Min pad opening 0.076mm(3mil)
Min S/M Bridge ±0.076mm(±3mil)
carbon ink board manufacturing capability:1.Impedance Control:20K±10% 2.Hardness:6H 3.bearable friction times :above 200000 times
  Technology    
  Min trace/space(inner/external) 3/3 mil0.075/0.075mm  
  Min drill size for through hole drill 8.0 mil0.20mm  
  Laser dill 4 mil0.1mm  
  Copper Foil Thickness 17-210um  
  Inner Core Thickness ±0.08mm  
  Tolerance of total board thickness ±0.015mm  
  Max .Unit Area 700-800  
  Min. Unit Area 2-5mm  
  Max Layer 1-18 Layers  
  Surface Treatment    
  Solder Coating Thickness Sn 4-20um  
  Cobalt/ Gold plating, Hard Gold Thickness Ni:5-10umAu:0.05-0.20um  
  Gold/Nickel Plating Thickness Ni:5-10umAu:0.05-0.15um  
  OSP Coating Thickness 0.2-0.5um  
  Electroness Au Thickness Ni:3-15umAu:0.025-0.10mm  
  Chem .Tin Thickness Sn:0.8-5um  
  Producting Capacity each day :800-100m2  
  Aspect Ratio 6:01:00  
  Hole Registration 0.004" (0.1mm)  

Trade Terms:
1. Payment: T/T in advance (Western Union , payple is welcomed)
2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.
3. Sample can be delivered in 3days
4. Shipping freight are quoted under your requests
5. Shipping port: Shen zhen,Mainland China
6. Discounts are offered based on order quantities
7. MOQ: 1PCS
Package &Shipping Methods:
1.Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement

 

Contact Details
Shenzhen Found Printed Circuit Board Co., Ltd.

Contact Person: Astrid

Tel: +8618872781653

Send your inquiry directly to us