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Metal Core Aluminium PCB For Led / Led Light Main Printed Circuit Board

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Metal Core Aluminium PCB For Led / Led Light Main Printed Circuit Board

Metal Core Aluminium PCB For Led / Led Light Main Printed Circuit Board
Metal Core Aluminium PCB For Led / Led Light Main Printed Circuit Board Metal Core Aluminium PCB For Led / Led Light Main Printed Circuit Board

Large Image :  Metal Core Aluminium PCB For Led / Led Light Main Printed Circuit Board Get Best Price

Product Details:

Place of Origin: China
Brand Name: Found
Certification: UL E361831 ISO9001 TS16949
Model Number: fd36

Payment & Shipping Terms:

Minimum Order Quantity: 1PC
Price: Negotiable
Packaging Details: Vacuum Packing
Delivery Time: 2-8 days
Payment Terms: T/T
Supply Ability: 100000PC
Detailed Product Description
Copper Thickness: 0.5-3OZ Base Material: FR-4/aluminum/ceramic
Min. Line Spacing: 0.1mm4mil) Board Thickness: 0.2-6.0mm
Min. Line Width: 4mil Min. Hole Size: 3mil (0.075mm)
Surface Finishing: Immersion Gold Product Name: Pcb Board Assembly
Application: Pcb Circuit Boards Flexible Material: FR4/ROGERS/PET/HDI/CEM/PI
Solder Mask: Green Solder Mask Color: Red / Blue / Green / Black / White / Customize
Type: Electronic PCB Assembly Item: Shenzhen OEM PCB PCBA Assembly Manufacture For Electronic
Name: PCBA Assembly Usage: Home Theatre
Color: Customized Color Layer: 1/2/3/4/5.
High Light:

aluminum base pcb

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aluminium pcb circuit board

Aluminium PCB Board for Main Printed Circuit Board with LED PCB Board

Metal Core Aluminium PCB For Led / Led Light Main Printed Circuit Board 0

 

 

Pls see our pcb catalog below:
1. single side pcb 2. double side pcb
3. Multilayer pcb(3-26+ layers) 4. Flexible PCB(FPC)
5. Rigid-flex PCB board 6. Aluminum PCB board for LED(1-4 layers)
7. MCPCB board (1-4 layers) 8.Ceramic PCB(1-4 layers)
9. HDI pcb board 10. High frequency PCB
11. PCB assembly

PCB Description Our PCB Board Capability
PCB Surface Finishes electrolytic nickel-gold,
HASL(Lead Free, ENIG (Electroless Nickel/Immersion Gold, Carbon Ink, Golden Fingers, OSP (Entek, Immersion Tin, Immersion Silver
PCB Max. Size 1200mm×600mm
PCB Min. Size 5mm×5 mm
Bow & Twist Tolerance Single Side≤1.0%,Double Side≤0.7%, Muti-Layer≤0.5%
Min. Board Thickness & Tolerance 0.2mm±0.08mm
PCB Min. trace/spacing Tin board:0.2mm±20%(8mil±0%)
gold board:0.075mm±20%(3mil±0%)
Copper to Board Edge Spacing 0.5mm(20mil)
Hole to Trace Spacing 0.3mm(12mil)
Min. Hole Diameter 0.2mm±.076mm(8mil±3mil)
Min. Hole Clearance 0.4mm±.076mm(16mil±3mil)
Copper Thickness on Hole Wall 20-25um(0.79mil-1.0mil)
Hole Location Tolerance ±0.076mm(l±3mil)
Min Diameter of Punching Hole FR-4 board thickness≤1.0mm(40mil):1.0mm(40mil)
FR-4 board thickness 1.2-3.0mm(48-120mil):1.5mm(60mil)
PCB Min. Punching Slot FR-4 CEM-3 board thickness≤1. 0mm(40mil):0.8 mm×0.8 mm(32mil×32mil)
FR-4 board thickness1.2-3.0mm(48-120mil): 1.0 mm×1.0 mm(40mil×40mil)
Trace width variation ±0.076mm(±3mil)
Outline Tolerance Routing:±0.1mm (±4mil) ,Punching:±0.05mm (±2mil)
V-CUT Registration Tolerance±0.2mm (±8mil)
PCB BOARD Type Single-sided, double-sided, multi-layer
Major Material FR-4, CEM-1,CEM-3, high frequency laminates, Aluminum, NiFe-based, copper base
PCB BOARD Thickness 0.2-3.5mm
Base Copper Thickness 11um 35um 70um 105um
Max. aspect ratio(board thickness: hole size) 8:1
V-Cut Angle Tolerance ±5°
V-Cut Board Thickness 0.4mm -3.2mm(16mil -128mil)
Min SMT Pitch 0.3mm(12mil)
Min. Component mark 0.15mm(6mil)
Min. width of annular ring(finished) 0.15mm(6mil)/side
Min pad opening 0.076mm(3mil)
Min S/M Bridge ±0.076mm(±3mil)
carbon ink board manufacturing capability:1.Impedance Control:20K±10% 2.Hardness:6H 3.bearable friction times :above 200000 times
  Technology    
  Min trace/space(inner/external) 3/3 mil0.075/0.075mm  
  Min drill size for through hole drill 8.0 mil0.20mm  
  Laser dill 4 mil0.1mm  
  Copper Foil Thickness 17-210um  
  Inner Core Thickness ±0.08mm  
  Tolerance of total board thickness ±0.015mm  
  Max .Unit Area 700-800  
  Min. Unit Area 2-5mm  
  Max Layer 1-18 Layers  
  Surface Treatment    
  Solder Coating Thickness Sn 4-20um  
  Cobalt/ Gold plating, Hard Gold Thickness Ni:5-10umAu:0.05-0.20um  
  Gold/Nickel Plating Thickness Ni:5-10umAu:0.05-0.15um  
  OSP Coating Thickness 0.2-0.5um  
  Electroness Au Thickness Ni:3-15umAu:0.025-0.10mm  
  Chem .Tin Thickness Sn:0.8-5um  
  Producting Capacity each day :800-100m2  
  Aspect Ratio 6:01:00  
  Hole Registration 0.004" (0.1mm)  

 

Trade Terms:
1. Payment: T/T in advance (Western Union , payple is welcomed)
2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.
3. Sample can be delivered in 3days
4. Shipping freight are quoted under your requests
5. Shipping port: Shen zhen,Mainland China
6. Discounts are offered based on order quantities
7. MOQ: 1PCS
Package &Shipping Methods:
1.Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement

 

 

   
PCB Manufacture Capability
Item Manufacture Capability
Layers 1-26 Layers
HDI 2+N+2
Material Types Fr-4,Fr-5,High-Tg,Aluminum Based , Halogen Free,
Isola,Taconic,Arlon,Teflon,Rogers,
Max.Panel Dimension 39000mil * 47000mil (1000mm * 1200mm)
Outline Tolerance ± 4mil (± 0.10mm)
Board Thickness 8mil-236mil (0.2 - 6.0mm)
Board Thickness Tolerance ± 10%
Dielectric Thickness 3mil-8mil ( 0.075mm-0.20mm)
Min.Track Width 3mil ( 0.075mm )
Min.Track Space 3mil ( 0.075mm )
External Cu Thickness 0.5 OZ - 10 OZ ( 17um - 350um)
Internal Cu Thickness 0.5OZ - 6OZ ( 17um - 210um)
Drilling Bit Size ( CNC ) 6mil-256mil ( 0.15mm - 6.50mm)
Finished Hole Dimension 4mil-236mil(0.1mm - 6.0mm)
Hole Tolerance ± 2mil (± 0.05mm)
Laser Drilling Hole Size 4mil(0.1mm)
Aspect Ration 16: 1
Solder Mask Green,Blue,White,Black,Red,Yellow,Purple,etc.
Min Solder mask Bridge 2mil(0.050mm)
Plugged Hole Diameter 8mil-20mil ( 0.20mm-0.50mm)
Beveling 30o - 45o
V-scoring +/-0.1mm,15o30o45o60o
Impedance Control Min. 5%General10%
Surface Finishing HASL,HASL(lead Free),Immersion Gold
Immersion Silver,OSP,Hard Gold ( up to 100u" )
Certification UL RoHS ISO9001: 2000 ISO14000: 2004 SGS
Quality Standards Accept spcifications of customer and IPC(class II or III)
   
     



 

Features and benefits
1. The dielectric constant (DK) is low and stable, so the signal transmission is good without delay.
2. The characteristic of low dielectric loss makes the signal loss at a lower level, which makes the signal
transmission of the whole equipment excellent.
3. Delamination of copper foil will not be caused by the change of cold and heat due to the consistency
with the thermal expansion coefficient of copper foil.
4. Immersion gold has excellent surface planarity, particularly helpful for PCBs with BGA packages or even CSP mounted components to reduce failure rate during assembly and soldering.
5. UL, ISO certified PCB manufacturing factory.
6. Make delivery on time keeping 98% on-time-delivery rate.
7. Eligible products rate of first production: >95%
8. Experienced sales persons provide skilled customer services.
9. Fast and flexible to save the time of production from prototype to standard production

Contact Details
Shenzhen Found Printed Circuit Board Co., Ltd.

Contact Person: Astrid

Tel: +8618872781653

Send your inquiry directly to us