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Multi Electronic Circuit Board Assembly Plating Hard Gold Rogers4003C

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Multi Electronic Circuit Board Assembly Plating Hard Gold Rogers4003C

Multi Electronic Circuit Board Assembly Plating Hard Gold Rogers4003C
Multi Electronic Circuit Board Assembly Plating Hard Gold Rogers4003C Multi Electronic Circuit Board Assembly Plating Hard Gold Rogers4003C

Large Image :  Multi Electronic Circuit Board Assembly Plating Hard Gold Rogers4003C Get Best Price

Product Details:

Place of Origin: China
Brand Name: Found
Certification: UL:E361831
Model Number: Found146

Payment & Shipping Terms:

Minimum Order Quantity: 1PC
Price: Negotiatable
Packaging Details: Vacuum packing
Delivery Time: 2-8 days
Payment Terms: T/T
Supply Ability: 100000PC
Detailed Product Description
Copper Thickness: 1oz,1/2OZ 1OZ 2OZ 3OZ,1 Oz,1.5oz Base Material: FR-4,Aluminium,PCB Circuit Board,FR-4/Cluminum/Ceramic/CEM-3/RF-1
Min. Line Spacing: 0.1mm4mil),0.003",4mil,0.1mm,0.075mm =3mil Board Thickness: 1.6mm,1.6mm-3.2mm,0.8mm,0.3~2.5mm,0.4~3mm
Min. Line Width: 3mi,0.1mm,0.1 0mm,0.075mm/0.075mm(3mil/3mil) Min. Hole Size: 0.20mm,0.1mm,4mil-laser Drill
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fr4 printed circuit board

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fr4 double sided pcb

Plating Gold Hard Gold Rogers4003C PCB printed circuit board assembly
 

Product Description:

Item Specification
Material FR-4 / Hi-Tg FR-4 /CEM-3/CEM-1/Aluminium
Layer single layer,double layer,multi-layer(4-10)
Board Thickness 0.3mm-3.0mm,+/-0.1mm(tolerance)
Copper Thickness 1/2OZ-3OZ (35um to 105um),+/-8um(tolerance),purity 99.5%
Impedance Control ±10%
Bow and Twist MAX. 0.75%(SMT)
Anti-strip 0.88N/mm
Resistance ≤20
Reactance 500V
Min. Value  
Min. Trace/Space Width 6 mil,+/-0.15mm(tolerance)
SMD Pitch 10 mil
BGA Pitch 20 mil
Min Pad Space 4mil(SMT)
Plating Copper Thickness 15um

 

  Technology    
  Min trace/space(inner/external) 3/3 mil0.075/0.075mm  
  Min drill size for through hole drill 8.0 mil0.20mm  
  Laser dill 4 mil0.1mm  
  Copper Foil Thickness 17-210um  
  Inner Core Thickness ±0.08mm  
  Tolerance of total board thickness ±0.015mm  
  Max .Unit Area 700-800  
  Min. Unit Area 2-5mm  
  Max Layer 1-18 Layers  
  Surface Treatment    
  Solder Coating Thickness Sn 4-20um  
  Cobalt/ Gold plating, Hard Gold Thickness Ni:5-10umAu:0.05-0.20um  
  Gold/Nickel Plating Thickness Ni:5-10umAu:0.05-0.15um  
  OSP Coating Thickness 0.2-0.5um  
  Electroness Au Thickness Ni:3-15umAu:0.025-0.10mm  
  Chem .Tin Thickness Sn:0.8-5um  
  Producting Capacity each day :800-100m2  
  Aspect Ratio 6:01:00  
  Hole Registration 0.004" (0.1mm)  

 

Multi Electronic Circuit Board Assembly Plating Hard Gold Rogers4003C 0

 

Trade Terms:
1. Payment: T/T in advance (Western Union , payple is welcomed)
2. Production lead time 100PCS: 5-7days, 500~1000PCS: 7-10days, above 1000PCS 15-20days.
3. Sample can be delivered in 3days
4. Shipping freight are quoted under your requests
5. Shipping port: Shen zhen,Mainland China
6. Discounts are offered based on order quantities
7. MOQ: 1PCS


Package &Shipping Methods:
1.Vacuum package with silica gel, Carton box with packing belt.
2. By DHL, UPS, FedEx, TNT
3. By EMS (Usually for Russia Clients)
4. By sea for mass quantity according to customer's requirement

 

FAQ:

1. How to get a quotation?

For PCB,pls send us the Gerber/protel format file,For PCBA,pls send us the Gerber file and BOM.

2. What is the MOQ?

1 pcs is ok.

3.What is the lead time?

For PCB orders,the lead time is 2 to 10 days.For PCBA orders,the lead time will be 15 to 30 days.

4. Will the boards be tested before shipment?

Yes,all PCBs will be tested by Flying Probe or E-test.For PCBA,we will have AOI,X-ray,and functional test

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Contact Details
Shenzhen Found Printed Circuit Board Co., Ltd.

Contact Person: Lottie

Tel: +8615826676756

Send your inquiry directly to us