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PCB Fr4 Heavy Copper PCB SMT Electronic Assembly 3OZ 6OZ Rigid PCB

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PCB Fr4 Heavy Copper PCB SMT Electronic Assembly 3OZ 6OZ Rigid PCB

PCB Fr4 Heavy Copper PCB SMT Electronic Assembly 3OZ 6OZ Rigid PCB
PCB Fr4 Heavy Copper PCB SMT Electronic Assembly 3OZ 6OZ Rigid PCB PCB Fr4 Heavy Copper PCB SMT Electronic Assembly 3OZ 6OZ Rigid PCB

Large Image :  PCB Fr4 Heavy Copper PCB SMT Electronic Assembly 3OZ 6OZ Rigid PCB Get Best Price

Product Details:

Place of Origin: China
Brand Name: found
Certification: UL E361831 ISO9001 TS16949
Model Number: fd01

Payment & Shipping Terms:

Minimum Order Quantity: 1PC
Price: Negotiatable
Packaging Details: Vacuum packing
Delivery Time: 2-8 days
Payment Terms: T/T
Supply Ability: 100000PC
Detailed Product Description
Copper Thickness: 1/2OZ 1OZ 2OZ 3OZ Base Material: FR-4/Cluminum/Ceramic/CEM-3/RF-1
Min. Line Spacing: 0.075mm =3mil Board Thickness: 1.6mm-3.2mm,0.3~2.5mm
Min. Line Width: 0.075mm/0.075mm(3mil/3mil) Min. Hole Size: 4mil-laser Drill
Surface Finishing: HASL Lead Free Product Name: Multilayer PCB
Application: Electronics Device Type: Electronic Board
Solder Mask: Green/Blue/Black/Red Material: KB Class A Laminate FR4
Color: Blue On Your Request Solder Mask Color: Green Black Red
Service: PCB/Components Sourcing/Soldering/Progamming/Testing.. Usage: Lithium Battery Packs
Layers: 1-28 L Item: Custom Circuit Board
High Light:

fr4 printed circuit board

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fr4 copper clad sheet

PCB Fr4 Heavy Copper PCB SMT Electronic Assembly 3OZ 6OZ Rigid PCB

PCB Fr4 Heavy Copper PCB SMT Electronic Assembly 3OZ 6OZ Rigid PCB 0
 

PCB DescriptionOur PCB Board Capability
PCB Surface Finisheselectrolytic nickel-gold,
HASL(Lead Free, ENIG (Electroless Nickel/Immersion Gold, Carbon Ink, Golden Fingers, OSP (Entek, Immersion Tin, Immersion Silver
PCB Max. Size1200mm×600mm
PCB Min. Size5mm×5 mm
Bow & Twist ToleranceSingle Side≤1.0%,Double Side≤0.7%, Muti-Layer≤0.5%
Min. Board Thickness & Tolerance0.2mm±0.08mm
PCB Min. trace/spacingTin board:0.2mm±20%(8mil±0%)
gold board:0.075mm±20%(3mil±0%)
Copper to Board Edge Spacing0.5mm(20mil)
Hole to Trace Spacing0.3mm(12mil)
Min. Hole Diameter0.2mm±.076mm(8mil±3mil)
Min. Hole Clearance0.4mm±.076mm(16mil±3mil)
Copper Thickness on Hole Wall20-25um(0.79mil-1.0mil)
Hole Location Tolerance±0.076mm(l±3mil)
Min Diameter of Punching HoleFR-4 board thickness≤1.0mm(40mil):1.0mm(40mil)
FR-4 board thickness 1.2-3.0mm(48-120mil):1.5mm(60mil)
PCB Min. Punching SlotFR-4 CEM-3 board thickness≤1. 0mm(40mil):0.8 mm×0.8 mm(32mil×32mil)
FR-4 board thickness1.2-3.0mm(48-120mil): 1.0 mm×1.0 mm(40mil×40mil)
Trace width variation±0.076mm(±3mil)
Outline ToleranceRouting:±0.1mm (±4mil) ,Punching:±0.05mm (±2mil)
V-CUT Registration Tolerance±0.2mm (±8mil)
PCB BOARD TypeSingle-sided, double-sided, multi-layer
Major MaterialFR-4, CEM-1,CEM-3, high frequency laminates, Aluminum, NiFe-based, copper base
PCB BOARD Thickness0.2-3.5mm
Base Copper Thickness11um 35um 70um 105um
Max. aspect ratio(board thickness: hole size)8:1
V-Cut Angle Tolerance±5°
V-Cut Board Thickness0.4mm -3.2mm(16mil -128mil)
Min SMT Pitch0.3mm(12mil)
Min. Component mark0.15mm(6mil)
Min. width of annular ring(finished)0.15mm(6mil)/side
Min pad opening0.076mm(3mil)
Min S/M Bridge±0.076mm(±3mil)
carbon ink board manufacturing capability:1.Impedance Control:20K±10% 2.Hardness:6H 3.bearable friction times :above 200000 times
 Technology  
 Min trace/space(inner/external)3/3 mil0.075/0.075mm 
 Min drill size for through holedrill 8.0 mil0.20mm 
 Laser dill4 mil0.1mm 
 Copper Foil Thickness17-210um 
 Inner Core Thickness±0.08mm 
 Tolerance of total board thickness±0.015mm 
 Max .Unit Area700-800 
 Min. Unit Area2-5mm 
 Max Layer1-18 Layers 
 Surface Treatment  
 Solder Coating Thickness Sn4-20um 
 Cobalt/ Gold plating, Hard Gold ThicknessNi:5-10umAu:0.05-0.20um 
 Gold/Nickel Plating ThicknessNi:5-10umAu:0.05-0.15um 
 OSP Coating Thickness0.2-0.5um 
 Electroness Au ThicknessNi:3-15umAu:0.025-0.10mm 
 Chem .Tin ThicknessSn:0.8-5um 
 Producting Capacityeach day :800-100m2 
 Aspect Ratio6:01:00 
 Hole Registration0.004" (0.1mm) 
  • Product Details

Model NO.: Found-009
Condition: New
Product Type: PCB Assembly
Min.Hole Size: 0.12mm
Solder Mask Colour: Red
Surface Finish: HASL, Enig, OSP, Gold Finger
Min Trace Width/Space: 0.075/0.075mm
Copper Thickness: 1 - 12 Oz
Assembly Modes: SMT, DIP, Through Hole
Application Field: LED, Medical, Industrial, Control Board
Samples Run: Available
Trademark: OEM / ODM
Transport Package: Vacuum Packing/Blister/Plastic /Cartoon
Specification: Customized
Origin: China
HS Code: 8534009000

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Shenzhen Found Printed Circuit Board Co., Ltd.

Contact Person: Astrid

Tel: +8618872781653

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