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FR4 PCB CEM1 Ceramic Aluminum With Low Price printed circuit board

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FR4 PCB CEM1 Ceramic Aluminum With Low Price printed circuit board

FR4 PCB CEM1 Ceramic Aluminum With Low Price printed circuit board
FR4 PCB CEM1 Ceramic Aluminum With Low Price printed circuit board FR4 PCB CEM1 Ceramic Aluminum With Low Price printed circuit board

Large Image :  FR4 PCB CEM1 Ceramic Aluminum With Low Price printed circuit board Get Best Price

Product Details:

Place of Origin: China
Brand Name: Found
Certification: UL:E361831
Model Number: Found116

Payment & Shipping Terms:

Minimum Order Quantity: 1PC
Price: Negotiatable
Packaging Details: Vacuum packing
Delivery Time: 2-8 days
Payment Terms: T/T
Supply Ability: 100000PC
Detailed Product Description
Base Material: FR-4, CEM-1, FR-4/aluminum/ceramic, FR-4/aluminum/ceramic/cem-3/FR-1, Aluminum Surface Finishing: HASL, ENIG, OSP, HASL Lead Free, Immersion Gold
Product Name: Shenzhen Custom Multilayer Pcb Printed Circuit Board, Printing Circuit Board, Printed Circuit Design PCB Assembly Electronic Board Manufacturer, FPCB, OEM Multilayer 94v0 Bare Printed Circuit Board Application: Electronics Device, Consumer Electronics, Pcb Printed Circuit Board, Engineering Testing
Name: 94v0 Multilayer PCB Boards Printing Circuit Board, 5.1 Amplifier Pcb Printed Circuit Board Multilayer Pcb Manufacture, Industrial Control PCBA Customize Multilayer Printed Circuit Board, OEM Electronic Control Board Service: One Stop Turnkey Service, One-stop Service, PCB/Components Sourcing/Soldering/Programming/Testing.., PCB&PCBA
Material: FR4/ROGERS/PET/HDI/CEM/PI, FR4 Hight TG, FR4 /aluminum/ceramic CEM1 Item: DHL UPS EMS FEXDEX, Custom Circuit Board, 2 Layer Pcb, Multilayer PCB Board
High Light:

copper circuit board


12 layer pcb

FR4 PCB CEM1 Ceramic Aluminum With Low Price printed circuit board
PCB Description Our PCB Board Capability
PCB Surface Finishes electrolytic nickel-gold,
HASL(Lead Free, ENIG (Electroless Nickel/Immersion Gold, Carbon Ink, Golden Fingers, OSP (Entek, Immersion Tin, Immersion Silver
PCB Max. Size 1200mm×600mm
PCB Min. Size 5mm×5 mm
Bow & Twist Tolerance Single Side≤1.0%,Double Side≤0.7%, Muti-Layer≤0.5%
Min. Board Thickness & Tolerance 0.2mm±0.08mm
PCB Min. trace/spacing Tin board:0.2mm±20%(8mil±0%)
gold board:0.075mm±20%(3mil±0%)
Copper to Board Edge Spacing 0.5mm(20mil)
Hole to Trace Spacing 0.3mm(12mil)
Min. Hole Diameter 0.2mm±.076mm(8mil±3mil)
Min. Hole Clearance 0.4mm±.076mm(16mil±3mil)
Copper Thickness on Hole Wall 20-25um(0.79mil-1.0mil)
Hole Location Tolerance ±0.076mm(l±3mil)
Min Diameter of Punching Hole FR-4 board thickness≤1.0mm(40mil):1.0mm(40mil)
FR-4 board thickness 1.2-3.0mm(48-120mil):1.5mm(60mil)
PCB Min. Punching Slot FR-4 CEM-3 board thickness≤1. 0mm(40mil):0.8 mm×0.8 mm(32mil×32mil)
FR-4 board thickness1.2-3.0mm(48-120mil): 1.0 mm×1.0 mm(40mil×40mil)
Trace width variation ±0.076mm(±3mil)
Outline Tolerance Routing:±0.1mm (±4mil) ,Punching:±0.05mm (±2mil)
V-CUT Registration Tolerance±0.2mm (±8mil)
PCB BOARD Type Single-sided, double-sided, multi-layer
Major Material FR-4, CEM-1,CEM-3, high frequency laminates, Aluminum, NiFe-based, copper base
PCB BOARD Thickness 0.2-3.5mm
Base Copper Thickness 11um 35um 70um 105um
Max. aspect ratio(board thickness: hole size) 8:1
V-Cut Angle Tolerance ±5°
V-Cut Board Thickness 0.4mm -3.2mm(16mil -128mil)
Min SMT Pitch 0.3mm(12mil)
Min. Component mark 0.15mm(6mil)
Min. width of annular ring(finished) 0.15mm(6mil)/side
Min pad opening 0.076mm(3mil)
Min S/M Bridge ±0.076mm(±3mil)
carbon ink board manufacturing capability:1.Impedance Control:20K±10% 2.Hardness:6H 3.bearable friction times :above 200000 times
  Min trace/space(inner/external) 3/3 mil0.075/0.075mm  
  Min drill size for through hole drill 8.0 mil0.20mm  
  Laser dill 4 mil0.1mm  
  Copper Foil Thickness 17-210um  
  Inner Core Thickness ±0.08mm  
  Tolerance of total board thickness ±0.015mm  
  Max .Unit Area 700-800  
  Min. Unit Area 2-5mm  
  Max Layer 1-18 Layers  
  Surface Treatment    
  Solder Coating Thickness Sn 4-20um  
  Cobalt/ Gold plating, Hard Gold Thickness Ni:5-10umAu:0.05-0.20um  
  Gold/Nickel Plating Thickness Ni:5-10umAu:0.05-0.15um  
  OSP Coating Thickness 0.2-0.5um  
  Electroness Au Thickness Ni:3-15umAu:0.025-0.10mm  
  Chem .Tin Thickness Sn:0.8-5um  
  Producting Capacity each day :800-100m2  
  Aspect Ratio 6:01:00  
  Hole Registration 0.004" (0.1mm)  


FR4 PCB CEM1 Ceramic Aluminum With Low Price printed circuit board 0

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FR4 PCB CEM1 Ceramic Aluminum with low price

Base Material:FR4 CEM1
Copper Thickness:1/2OZ 1OZ 2OZ 3OZ
Board Thickness:0.2mm-4.5mm
Min. Hole Size:0.2mm
Min. Line Width:3mil
Min. Line Spacing:3mil
Surface Finishing:HASL-LF/OSP/ENIG etc
Product name:PCB board Manufacturer PCB Assembly PCB Design
Finish Hole Size:PTH ±0.003'' ,NPTH ±0.002"
Aspect Ratio:Min 1:8
Silk Screen Min Line Width:0.006" or 0.15mm
Impedance control:±5%
Ring annulus:Min 0.1mm
Solder Mask Rrgistration:±0.003"
Layer to layer Rrgistration:±0.003"
Min Plated Drills to Copper:0.25mm, 0.30mm
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