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Custom Dip Bom Contract Manufacturing Pcb Assembly Service Communication Electronics

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Custom Dip Bom Contract Manufacturing Pcb Assembly Service Communication Electronics

Custom Dip Bom Contract Manufacturing Pcb Assembly Service Communication Electronics
Custom Dip Bom Contract Manufacturing Pcb Assembly Service Communication Electronics

Large Image :  Custom Dip Bom Contract Manufacturing Pcb Assembly Service Communication Electronics

Product Details:
Place of Origin: CHINA
Brand Name: FASTPCB
Payment & Shipping Terms:
Minimum Order Quantity: 10PCS
Price: USD 0.01-100/PCS
Packaging Details: Corrugated case
Supply Ability: 10PCS+48Hour

Custom Dip Bom Contract Manufacturing Pcb Assembly Service Communication Electronics

Description
PCBA Type: Communication Electronics PCBA Manufacture Base Material: FR-4 High TG
Number Of Layers: 16 Layer Copper Thickness: 1 Oz.
Board Thickness: 2.0mm Min. Hole Size: 0.20mm
Min. Line Width: 0.075mm Min. Line Spacing: 0.070mm
Surface Finishing: Immersion Gold+OSP Solder Mask Color: Green
Min. Blind Via: 0.10mm
High Light:

Bom Pcb Assembly

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Custom Circuit Board Assembly

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Dip Assembly

Communication Electronics PCBA Manufacture

Communication electronic products are mainly divided into wired communication equipment and wireless communication equipment
1. Wired communication refers to the cable connection between communication equipment transmission, that is, the use of overhead cable, coaxial cable, optical fiber, audio cable and other transmission media to transmit information. Commonly used cable communication equipment: computer, TELEVISION, telephone, PCM, optical terminal machine, server and so on.
2. Wireless communication refers to communication without physical connection lines, that is, information exchange using the characteristics of electromagnetic wave signals that can spread in free space. Wireless communication equipment commonly have satellite, radio station, radio TV (bus or subway), wireless LAN, mobile phone (mobile phone), mobile PHONE GPRS Internet access, walkie-talkie, etc

HLC Process capability

Item HLC Advanced Technology
2019 2020 2021
Max Panel Width (inch) 25 25 25
Max Panel Length (inch) 29 29 29
Max Layer Count (L) 16 18 36
Max Board thickness (mm) 3.2 4 6
Max Board thickness Tolerance +/-10% +/-10% +/-10%
Base copper Thickness Inner layer ( OZ ) 4 6 8
Outer Layer ( OZ ) 2 3 4
Min DHS ( mm ) 0.2 0.15 0.15
PTH Size Tolerance ( mil ) +/-2 +/-2 +/-2
Back Drill (stub)( mil ) ~ 3 ~ 2.4 ~ 2
Max. AR 12:1 16:1 20:1
Item HLC Advanced Technology
2019 2020 2021
M-drill tolerance Inner layer ( mil ) DHS + 10 DHS + 10 DHS + 8
Outer Layer ( mil ) DHS + 8 DHS + 8 DHS + 6
Solder mask Registration (um) +/- 40 +/- 30 +/- 25
Impedance control ≥50ohms +/-10% +/-10% -/-8%
<50ohms 5 Ω 5 Ω 4 Ω
Min LW/S (Inner)@1oz base Cu ( mil ) 3.0 / 3.0 2.6 / 2.6 2.5 / 2.5
Min LW/S (Outer)@1oz Cu ( mil ) 3.5 / 3.5 3.0 / 3.5 3.0 / 3.0
Max dimple for POFV ( um ) 30 20 15
Surface Finishing ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au

HDI Process capability

Item HDI Advanced Technology
2019 2020 2021
Structure 5+n+5 6+n+6 7+n+7
HDI Stack Via AnyLayer(12L) AnyLayer(14L) AnyLayer(16L)
Board Thickness(mm) Min. 8L 0.45 0.4 0.35
Min. 10L 0.55 0.45 0.4
Min. 12L 0.65 0.6 0.55
MAX.   2.4  
Min. Core Thickness ( um ) 50 40 40
Min. PP Thickness ( um ) 30(#1027PP) 25(#1017PP) 20(#1010PP)
Base Copper Thickness Inner Layer ( OZ) 1/3 ~ 2 1/3 ~ 2 1/3 ~ 2
Outer Layer ( OZ ) 1/3 ~ 1 1/3 ~ 1 1/3 ~ 1
Item HDI Advanced Technology
2019 2020 2021
Min. Mechanical Drill hole size(um) ** 200 200 150
Max. Through Hole Aspect Ratio * 8:1 10:1 10:1
Min. Laser via/Pad Size ( um ) 75/200 70/170 60/150
Max. Laser Via Aspect Ratio 0.8:1 0.8:1 0.8:1
Laser Via on PTH(VOP)design Yes Yes Yes
Laser X type through hole(DT≤200um) NA 60~100um 60~100um
Min. LW/S (L/S/Cu, um) Inner Layer 45 /45 /15 40/ 40/ 15 30/ 30 /15
outer Layer 50 /50/ 20 40 /50 /20 40 /40 /17
Min BGA Pitch (mm)   0.35 0.3 0.3
Item HDI Advanced Technology
2019 2020 2021
Solder mask Registration (um) +/- 30 +/- 25 +/- 20
Min. Solder Mask Dam (mm) 0.07 0.06 0.05
PCB Warpage Control >= 50ohm +/-10% +/-8% +/- 5%
< 50ohm +/- 5ohm +/- 3ohm +/- 3ohm
PCB Warpage Control ≤0.5% ≤0.5% ≤0.5%
cavity Depth accuracy (um) Mechanical +/- 75 +/- 75 +/- 50
Laser directly +/- 50 +/- 50 +/- 50
Surface Finishing OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG

SMT Capability

Item SMT Capability
2019 2020 2021
Min board thickness ( mm ) 0.1 0.06 0.05
Max. board size ( mm ) 200 x 250 250 x 300 250 x 350
Chip component ( L, C, R etc. ) Minimum size 1005 1005 1005
Connector 0.5 mm pitch Y Y Y
0.4 mm pitch Y Y Y
0.35 mm pitch Y Y Y
High density component : 0.5 mm pitch Y Y Y
TSOP, QFP, QFN, LGA, BGA etc. 0.4 mm pitch Y Y Y
  0.35 mm pitch Y Y Y
Reflow N2 reflow No Y Y
Under-fill Fill under chip Manual Auto Auto
ACF attach Gold finger pitch N/A 0.3 mm 0.2 mm
Inspection Component position, direction, missing etc. Manual check with 10 x scope Auto AOI inspection Auto AOI inspection
Solder paste thickness Measure once per shift 1 line auto full area, online SPI All lines auto full area, online SPI

 

Packaging & Delivery
Packaging Details: Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement.
Port: Shenzhen or Hongkong
Lead Time: Quantity(Pieces) 1-10 11-100 101-1000 >1000
  Est. Time(days) 3-5 3-5 7-9

To be negotiated

 

 

FAQ:

Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.

 

Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.

 

Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

 

Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.

 

Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.

 

Q: Are you factory?

FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China

Custom Dip Bom Contract Manufacturing Pcb Assembly Service Communication Electronics 0

Contact Details
Quanhong FASTPCB

Contact Person: zhengshuangli

Tel: +8618820288062

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