Home ProductsPCB Assembly Service

Ems Rapid Quick Turn Pcba Printed Circuit Board Assembly Services For Bluetooth Products

Certification
China Quanhong FASTPCB certification
China Quanhong FASTPCB certification
I'm Online Chat Now

Ems Rapid Quick Turn Pcba Printed Circuit Board Assembly Services For Bluetooth Products

Ems Rapid Quick Turn Pcba Printed Circuit Board Assembly Services For Bluetooth Products
Ems Rapid Quick Turn Pcba Printed Circuit Board Assembly Services For Bluetooth Products

Large Image :  Ems Rapid Quick Turn Pcba Printed Circuit Board Assembly Services For Bluetooth Products

Product Details:
Place of Origin: CHINA
Brand Name: FASTPCB
Payment & Shipping Terms:
Minimum Order Quantity: 10PCS
Price: USD 0.01-100/PCS
Packaging Details: Corrugated case
Supply Ability: 10PCS+48Hour

Ems Rapid Quick Turn Pcba Printed Circuit Board Assembly Services For Bluetooth Products

Description
PCBA Type: Bluetooth Products PCBA Manufacture Base Material: FR-4
Number Of Layers: 6 Layer Copper Thickness: 1Oz.
Board Thickness: 0.8mm Min. Hole Size: 0.20mm
Min. Line Width: 0.085mm Min. Line Spacing: 0.095mm
Surface Finishing: Immersion Gold Solder Mask Color: Green
High Light:

Rapid Pcba

,

Ems Pcba

,

Turnkey Pcba

  Bluetooth technology is an open global specification for wireless data and voice communication. It is a special near field (NFC) technology connection based on low cost, which establishes communication environment for fixed and mobile devices

  Bluetooth products are used in traditional mobile phones, tablets, Bluetooth speakers ,Bluetooth headset and vehicle-mounted Bluetooth systems, and have been gradually applied in smart medical care, smart lighting, smart wearables, Bluetooth MAC address scanning and printing, and smart door locks.

HLC Process capability

Item HLC Advanced Technology
2019 2020 2021
Max Panel Width (inch) 25 25 25
Max Panel Length (inch) 29 29 29
Max Layer Count (L) 16 18 36
Max Board thickness (mm) 3.2 4 6
Max Board thickness Tolerance +/-10% +/-10% +/-10%
Base copper Thickness Inner layer ( OZ ) 4 6 8
Outer Layer ( OZ ) 2 3 4
Min DHS ( mm ) 0.2 0.15 0.15
PTH Size Tolerance ( mil ) +/-2 +/-2 +/-2
Back Drill (stub)( mil ) ~ 3 ~ 2.4 ~ 2
Max. AR 12:1 16:1 20:1
Item HLC Advanced Technology
2019 2020 2021
M-drill tolerance Inner layer ( mil ) DHS + 10 DHS + 10 DHS + 8
Outer Layer ( mil ) DHS + 8 DHS + 8 DHS + 6
Solder mask Registration (um) +/- 40 +/- 30 +/- 25
Impedance control ≥50ohms +/-10% +/-10% -/-8%
<50ohms 5 Ω 5 Ω 4 Ω
Min LW/S (Inner)@1oz base Cu ( mil ) 3.0 / 3.0 2.6 / 2.6 2.5 / 2.5
Min LW/S (Outer)@1oz Cu ( mil ) 3.5 / 3.5 3.0 / 3.5 3.0 / 3.0
Max dimple for POFV ( um ) 30 20 15
Surface Finishing ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au

HDI Process capability

Item HDI Advanced Technology
2019 2020 2021
Structure 5+n+5 6+n+6 7+n+7
HDI Stack Via AnyLayer(12L) AnyLayer(14L) AnyLayer(16L)
Board Thickness(mm) Min. 8L 0.45 0.4 0.35
Min. 10L 0.55 0.45 0.4
Min. 12L 0.65 0.6 0.55
MAX.   2.4  
Min. Core Thickness ( um ) 50 40 40
Min. PP Thickness ( um ) 30(#1027PP) 25(#1017PP) 20(#1010PP)
Base Copper Thickness Inner Layer ( OZ) 1/3 ~ 2 1/3 ~ 2 1/3 ~ 2
Outer Layer ( OZ ) 1/3 ~ 1 1/3 ~ 1 1/3 ~ 1
Item HDI Advanced Technology
2019 2020 2021
Min. Mechanical Drill hole size(um) ** 200 200 150
Max. Through Hole Aspect Ratio * 8:1 10:1 10:1
Min. Laser via/Pad Size ( um ) 75/200 70/170 60/150
Max. Laser Via Aspect Ratio 0.8:1 0.8:1 0.8:1
Laser Via on PTH(VOP)design Yes Yes Yes
Laser X type through hole(DT≤200um) NA 60~100um 60~100um
Min. LW/S (L/S/Cu, um) Inner Layer 45 /45 /15 40/ 40/ 15 30/ 30 /15
outer Layer 50 /50/ 20 40 /50 /20 40 /40 /17
Min BGA Pitch (mm)   0.35 0.3 0.3
Item HDI Advanced Technology
2019 2020 2021
Solder mask Registration (um) +/- 30 +/- 25 +/- 20
Min. Solder Mask Dam (mm) 0.07 0.06 0.05
PCB Warpage Control >= 50ohm +/-10% +/-8% +/- 5%
< 50ohm +/- 5ohm +/- 3ohm +/- 3ohm
PCB Warpage Control ≤0.5% ≤0.5% ≤0.5%
cavity Depth accuracy (um) Mechanical +/- 75 +/- 75 +/- 50
Laser directly +/- 50 +/- 50 +/- 50
Surface Finishing OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG

SMT Capability

Item SMT Capability
2019 2020 2021
Min board thickness ( mm ) 0.1 0.06 0.05
Max. board size ( mm ) 200 x 250 250 x 300 250 x 350
Chip component ( L, C, R etc. ) Minimum size 1005 1005 1005
Connector 0.5 mm pitch Y Y Y
0.4 mm pitch Y Y Y
0.35 mm pitch Y Y Y
High density component : 0.5 mm pitch Y Y Y
TSOP, QFP, QFN, LGA, BGA etc. 0.4 mm pitch Y Y Y
  0.35 mm pitch Y Y Y
Reflow N2 reflow No Y Y
Under-fill Fill under chip Manual Auto Auto
ACF attach Gold finger pitch N/A 0.3 mm 0.2 mm
Inspection Component position, direction, missing etc. Manual check with 10 x scope Auto AOI inspection Auto AOI inspection
Solder paste thickness Measure once per shift 1 line auto full area, online SPI All lines auto full area, online SPI

 

Packaging & Delivery
Packaging Details: Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement.
Port: Shenzhen or Hongkong
Lead Time: Quantity(Pieces) 1-10 11-100 101-1000 >1000
  Est. Time(days) 3-5 3-5 7-9

To be negotiated

 

 

FAQ:

Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.

 

Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.

 

Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

 

Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.

 

Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.

 

Q: Are you factory?

FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, ChinaEms Rapid Quick Turn Pcba Printed Circuit Board Assembly Services For Bluetooth Products 0

Contact Details
Quanhong FASTPCB

Contact Person: zhengshuangli

Send your inquiry directly to us (0 / 3000)