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16 Layer Fpc Hdi Multilayer Pcb High Density Interconnect Boards 2.1mm

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16 Layer Fpc Hdi Multilayer Pcb High Density Interconnect Boards 2.1mm

16 Layer Fpc Hdi Multilayer Pcb High Density Interconnect Boards 2.1mm
16 Layer Fpc Hdi Multilayer Pcb High Density Interconnect Boards 2.1mm 16 Layer Fpc Hdi Multilayer Pcb High Density Interconnect Boards 2.1mm

Large Image :  16 Layer Fpc Hdi Multilayer Pcb High Density Interconnect Boards 2.1mm

Product Details: Payment & Shipping Terms:
Minimum Order Quantity: 10PCS
Price: USD 0.01-100PCS
Packaging Details: Corrugated case
Supply Ability: 10PCS+15DAY(production time )

16 Layer Fpc Hdi Multilayer Pcb High Density Interconnect Boards 2.1mm

Description
PCB: High Density Interconnector PCB Base Material: FR-4 TG170
Number Of Layers: 16 Layer Board Thickness: 2.1mm
Min. Hole Size: 0.2mm Min.blind Via: 0.1mm
Min. Line Width: 0.070mm Min. Line Spacing: 0.065mm
Solder Mask Color: Black Surface Treatment: Immersion Gold
Characteristic 1: Backdrill Characteristic 2: Hole On Pad
Characteristic 3: Sidestep Hole
High Light:

pcb fpc hdi

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16 Layer Fpc Hdi Multilayer Pcb 2.1mm

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high density interconnect printed circuit boards

HDI stands for High Density Interconnector. It is a kind of printed circuit board that uses micro-blind buried hole technology to produce a circuit

High Density Interconnector PCB

board with High circuit distribution Density. HDI is a compact product designed for small volume users.

HDI circuit advantages

1. Reduce PCB cost: When PCB density increases to more than eight layers, the cost of HDI manufacturing will be lower than the traditional complex pressing process.

2. Increase circuit density: traditional circuit board and parts interconnection

3. It is conducive to the use of advanced construction technology

4. Better electrical performance and signal correctness

5. Better reliability

6. Can improve the thermal properties

7. Can improve rf interference/electromagnetic interference/electrostatic release (RFI/EMI/ESD)

8. Increase design efficiency

 

Item HDI Advanced Technology
2019 2020 2021
Structure 5+n+5 6+n+6 7+n+7
HDI Stack Via AnyLayer(12L) AnyLayer(14L) AnyLayer(16L)
Board Thickness(mm) Min. 8L 0.45 0.4 0.35
Min. 10L 0.55 0.45 0.4
Min. 12L 0.65 0.6 0.55
MAX.   2.4  
Min. Core Thickness ( um ) 50 40 40
Min. PP Thickness ( um ) 30(#1027PP) 25(#1017PP) 20(#1010PP)
Base Copper Thickness Inner Layer ( OZ) 1/3 ~ 2 1/3 ~ 2 1/3 ~ 2
Outer Layer ( OZ ) 1/3 ~ 1 1/3 ~ 1 1/3 ~ 1
Item HDI Advanced Technology
2019 2020 2021
Min. Mechanical Drill hole size(um) ** 200 200 150
Max. Through Hole Aspect Ratio * 8:1 10:1 10:1
Min. Laser via/Pad Size ( um ) 75/200 70/170 60/150
Max. Laser Via Aspect Ratio 0.8:1 0.8:1 0.8:1
Laser Via on PTH(VOP)design Yes Yes Yes
Laser X type through hole(DT≤200um) NA 60~100um 60~100um
Min. LW/S (L/S/Cu, um) Inner Layer 45 /45 /15 40/ 40/ 15 30/ 30 /15
outer Layer 50 /50/ 20 40 /50 /20 40 /40 /17
Min BGA Pitch (mm)   0.35 0.3 0.3
Item HDI Advanced Technology
2019 2020 2021
Solder mask Registration (um) +/- 30 +/- 25 +/- 20
Min. Solder Mask Dam (mm) 0.07 0.06 0.05
PCB Warpage Control >= 50ohm +/-10% +/-8% +/- 5%
< 50ohm +/- 5ohm +/- 3ohm +/- 3ohm
PCB Warpage Control ≤0.5% ≤0.5% ≤0.5%
cavity Depth accuracy (um) Mechanical +/- 75 +/- 75 +/- 50
Laser directly +/- 50 +/- 50 +/- 50
Surface Finishing OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG

 

Packaging & Delivery
Packaging Details: Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement.
Port: Shenzhen or Hongkong
Lead Time: Quantity(Pieces) 1-10 11-100 101-1000 >1000
  Est. Time(days) 20 21 25 To be negotiated

 

FAQ:

Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.

 

Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.

 

Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

 

Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.

 

Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.

 

Q: Are you factory?

FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China

16 Layer Fpc Hdi Multilayer Pcb High Density Interconnect Boards 2.1mm 0

Contact Details
Quanhong FASTPCB

Contact Person: zhengshuangli

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