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Product Details:
Payment & Shipping Terms:
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| PCB: | High Density Interconnector PCB | Base Material: | FR-4 TG170 |
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| Number Of Layers: | 16 Layer | Board Thickness: | 2.1mm |
| Min. Hole Size: | 0.2mm | Min.blind Via: | 0.1mm |
| Min. Line Width: | 0.070mm | Min. Line Spacing: | 0.065mm |
| Solder Mask Color: | Black | Surface Treatment: | Immersion Gold |
| Characteristic 1: | Backdrill | Characteristic 2: | Hole On Pad |
| Characteristic 3: | Sidestep Hole | ||
| High Light: | pcb fpc hdi 2.1mm,16 Layer Fpc Hdi Multilayer Pcbs 2.1mm,high density interconnect printed circuit boards 2.1mm |
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HDI stands for High Density Interconnector. It is a kind of printed circuit board that uses micro-blind buried hole technology to produce a circuit
High Density Interconnector PCB
board with High circuit distribution Density. HDI is a compact product designed for small volume users.
HDI circuit advantages
1. Reduce PCB cost: When PCB density increases to more than eight layers, the cost of HDI manufacturing will be lower than the traditional complex pressing process.
2. Increase circuit density: traditional circuit board and parts interconnection
3. It is conducive to the use of advanced construction technology
4. Better electrical performance and signal correctness
5. Better reliability
6. Can improve the thermal properties
7. Can improve rf interference/electromagnetic interference/electrostatic release (RFI/EMI/ESD)
8. Increase design efficiency
| Item | HDI Advanced Technology | |||
| 2019 | 2020 | 2021 | ||
| Structure | 5+n+5 | 6+n+6 | 7+n+7 | |
| HDI Stack Via | AnyLayer(12L) | AnyLayer(14L) | AnyLayer(16L) | |
| Board Thickness(mm) | Min. 8L | 0.45 | 0.4 | 0.35 |
| Min. 10L | 0.55 | 0.45 | 0.4 | |
| Min. 12L | 0.65 | 0.6 | 0.55 | |
| MAX. | 2.4 | |||
| Min. Core Thickness ( um ) | 50 | 40 | 40 | |
| Min. PP Thickness ( um ) | 30(#1027PP) | 25(#1017PP) | 20(#1010PP) | |
| Base Copper Thickness | Inner Layer ( OZ) | 1/3 ~ 2 | 1/3 ~ 2 | 1/3 ~ 2 |
| Outer Layer ( OZ ) | 1/3 ~ 1 | 1/3 ~ 1 | 1/3 ~ 1 | |
| Item | HDI Advanced Technology | |||
| 2019 | 2020 | 2021 | ||
| Min. Mechanical Drill hole size(um) ** | 200 | 200 | 150 | |
| Max. Through Hole Aspect Ratio * | 8:1 | 10:1 | 10:1 | |
| Min. Laser via/Pad Size ( um ) | 75/200 | 70/170 | 60/150 | |
| Max. Laser Via Aspect Ratio | 0.8:1 | 0.8:1 | 0.8:1 | |
| Laser Via on PTH(VOP)design | Yes | Yes | Yes | |
| Laser X type through hole(DT≤200um) | NA | 60~100um | 60~100um | |
| Min. LW/S (L/S/Cu, um) | Inner Layer | 45 /45 /15 | 40/ 40/ 15 | 30/ 30 /15 |
| outer Layer | 50 /50/ 20 | 40 /50 /20 | 40 /40 /17 | |
| Min BGA Pitch (mm) | 0.35 | 0.3 | 0.3 | |
| Item | HDI Advanced Technology | |||
| 2019 | 2020 | 2021 | ||
| Solder mask Registration (um) | +/- 30 | +/- 25 | +/- 20 | |
| Min. Solder Mask Dam (mm) | 0.07 | 0.06 | 0.05 | |
| PCB Warpage Control | >= 50ohm | +/-10% | +/-8% | +/- 5% |
| < 50ohm | +/- 5ohm | +/- 3ohm | +/- 3ohm | |
| PCB Warpage Control | ≤0.5% | ≤0.5% | ≤0.5% | |
| cavity Depth accuracy (um) | Mechanical | +/- 75 | +/- 75 | +/- 50 |
| Laser directly | +/- 50 | +/- 50 | +/- 50 | |
| Surface Finishing | OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag | OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG | ||
| Packaging & Delivery | |||||
| Packaging Details: | Inner: vacuum packing or Anti-static package, Outer: export carton or according to the customer's requirement. |
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| Port: | Shenzhen or Hongkong | ||||
| Lead Time: | Quantity(Pieces) | 1-10 | 11-100 | 101-1000 | >1000 |
| Est. Time(days) | 20 | 21 | 25 | To be negotiated | |
FAQ:
Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.
Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.
Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.
Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.
Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.
Q: Are you factory?
FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China
Contact Person: zhengshuangli
Tel: +8618820288062
