Home ProductsRigid Flex PCB

8 Layer Multilayer Rigid Flex Pcb Assembly Motherboard 1.6mm

China Quanhong FASTPCB certification
China Quanhong FASTPCB certification
I'm Online Chat Now

8 Layer Multilayer Rigid Flex Pcb Assembly Motherboard 1.6mm

8 Layer Multilayer Rigid Flex Pcb Assembly Motherboard 1.6mm
8 Layer Multilayer Rigid Flex Pcb Assembly Motherboard 1.6mm 8 Layer Multilayer Rigid Flex Pcb Assembly Motherboard 1.6mm 8 Layer Multilayer Rigid Flex Pcb Assembly Motherboard 1.6mm 8 Layer Multilayer Rigid Flex Pcb Assembly Motherboard 1.6mm

Large Image :  8 Layer Multilayer Rigid Flex Pcb Assembly Motherboard 1.6mm

Product Details: Payment & Shipping Terms:
Minimum Order Quantity: 10PCS
Price: USD 0.01-100PCS
Packaging Details: Corrugated case
Supply Ability: 10PCS+48Hour(production time )

8 Layer Multilayer Rigid Flex Pcb Assembly Motherboard 1.6mm

PCB: Multilayer Rigid Flex PCB Base Material: FR-4+PI
Number Of Layers: 8 Layer Copper Thickness: 1 Oz.
Board Thickness: 1.6mm Min. Hole Size: 0.2mm
Min. Line Width: 0.087mm Min. Line Spacing: 0.075mm
Surface Finishing: Immersion Gold
High Light:

8 Layer Multilayer Rigid Flex Pcb


Multilayer Rigid Flex Pcb Assembly 1.6mm


8 layer pcb motherboard

Multilayer Rigid Flex PCB

Rigid flex board is a combination of soft board and hard board. It is a circuit board formed by combining the thin flexible bottom layer and rigid bottom layer, and then laminating into a single component. Rigid flexible composite plate has changed the traditional plane design concept and expanded to the three-dimensional space concept. It not only brings great convenience to product design, but also brings great challenges.
The application scope of rigid flex combination board mainly includes: aerospace, such as high-end aircraft mounted weapon navigation system, advanced medical equipment, digital camera, portable camera and high-quality MP3 player. Rigid flexible composite plates are most commonly used in the manufacture of military aircraft and medical equipment. The rigid flexible joint plate brings great benefits to the design of military aircraft, because it not only improves the connection reliability, but also reduces the weight. Of course, the benefits brought by the reduction of the overall volume can not be ignored
Although the cost of rigid flexible composite plate is more expensive than traditional rigid plate, it provides an ideal solution for the project. It uses the interconnection of flexible substrates rather than the connection equipment of multiple PCBs, which is the key to reduce the occupied space and weight, which is required by many designs.
The rigid flexible composite board is flexible and foldable, so it can be used to make customized circuits and maximize the use of indoor available space, which reduces the space occupied by the whole system. The overall cost of the rigid flexible composite board will be relatively high, but with the continuous maturity and development of the industry, the overall cost will continue to decrease, Therefore, it will be more cost-effective and competitive.

HDI Advanced Technology

Item HDI Advanced Technology
2019 2020 2021
Structure 5+n+5 6+n+6 7+n+7
HDI Stack Via AnyLayer(12L) AnyLayer(14L) AnyLayer(16L)
Board Thickness(mm) Min. 8L 0.45 0.4 0.35
Min. 10L 0.55 0.45 0.4
Min. 12L 0.65 0.6 0.55
MAX.   2.4  
Min. Core Thickness ( um ) 50 40 40
Min. PP Thickness ( um ) 30(#1027PP) 25(#1017PP) 20(#1010PP)
Base Copper Thickness Inner Layer ( OZ) 1/3 ~ 2 1/3 ~ 2 1/3 ~ 2
Outer Layer ( OZ ) 1/3 ~ 1 1/3 ~ 1 1/3 ~ 1
Item HDI Advanced Technology
2019 2020 2021
Min. Mechanical Drill hole size(um) ** 200 200 150
Max. Through Hole Aspect Ratio * 8:1 10:1 10:1
Min. Laser via/Pad Size ( um ) 75/200 70/170 60/150
Max. Laser Via Aspect Ratio 0.8:1 0.8:1 0.8:1
Laser Via on PTH(VOP)design Yes Yes Yes
Laser X type through hole(DT≤200um) NA 60~100um 60~100um
Min. LW/S (L/S/Cu, um) Inner Layer 45 /45 /15 40/ 40/ 15 30/ 30 /15
outer Layer 50 /50/ 20 40 /50 /20 40 /40 /17
Min BGA Pitch (mm)   0.35 0.3 0.3
Item HDI Advanced Technology
2019 2020 2021
Solder mask Registration (um) +/- 30 +/- 25 +/- 20
Min. Solder Mask Dam (mm) 0.07 0.06 0.05
PCB Warpage Control >= 50ohm +/-10% +/-8% +/- 5%
< 50ohm +/- 5ohm +/- 3ohm +/- 3ohm
PCB Warpage Control ≤0.5% ≤0.5% ≤0.5%
cavity Depth accuracy (um) Mechanical +/- 75 +/- 75 +/- 50
Laser directly +/- 50 +/- 50 +/- 50
Surface Finishing OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG


Packaging & Delivery
Packaging Details: Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement.
Port: Shenzhen or Hongkong
Lead Time: Quantity(Pieces) 1-10 11-100 101-1000 >1000
  Est. Time(days) 3-5 3-5 7-9 To be negotiated


Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.

Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.

Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.

Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.

Q: Are you factory?
FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China

8 Layer Multilayer Rigid Flex Pcb Assembly Motherboard 1.6mm 0

Contact Details
Quanhong FASTPCB

Contact Person: zhengshuangli

Send your inquiry directly to us (0 / 3000)