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Product Details:
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| FPC Type: | Multilayer Flexible Circuit Board | Base Material: | FCCL |
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| Number Of Layers: | 8 Layer | Copper Thickness: | 1/2 Oz. |
| Board Thickness: | 0.35mm | Min. Hole Size: | 0.20mm |
| Min. Line Width: | 0.075mm | Min. Line Spacing: | 0.075mm |
| Surface Finishing: | Immersion Gold | ||
| High Light: | Plain PCB Board |
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Multilayer Flexible Circuit Board is a flexible printed circuit board developed and produced by Shenzhen Quanhong Electronics Co., Ltd., which is made of DuPont and Taiflex brand materials, surface gold deposition and laser drilling. The minimum line width and line spacing can reach 75 / 75um and the minimum aperture can reach 0.2mm. The circuit board is widely used in mobile phones, laptops, automobiles, tablet computers and other fields.
| Item | Flex & Rigid-Flex Technology | ||
| 2019 | 2020 | ||
| Flex Layer Count | 6 | 8 | |
| Roll Width/PNL Size( mm ) | Roll Width (inner layer) | 250 | 500 |
| Working PNL Size | 250 x 250 ~ 500 | 500 x 610 | |
| Min Line / Space ( um ) | Inner layer with CF | 40 /40 / 12 | 35 /35 /12 |
| (L/S/Cu thickness) | 50 /50 /18 | 45 /45 /18 | |
| Outer layer with plated Cu | 55 /55 / 25 | 50 /50 /25 | |
| 63 /63 /35 | 55 /55 /35 | ||
| Via Structure | Laser blind via size (um) | 75 | 65 |
| Stacked via structure | Y | Y | |
| Laser through via ( um ) | 100 | 75 | |
| M-drill hole size ( um ) | 150 | 100 | |
| Min Pad size ( um ) | Inner layer with CF | D + 225 | D + 175 |
| Outer layer with plated Cu | D + 200 | D + 150 | |
| Button plating | D + 250 | D + 200 | |
| Item | Flex & Rigid-Flex Technology | ||
| 2019 | 2020 | ||
| Cover-layer ( um ) | Registration | +/- 150 | +/- 125 |
| Solder mask ( um ) | Registration | +/- 50 | +/- 37.5 |
| Dam capability | 100 | 75 | |
| E-test SMT pitch ( um ) | Dam capability | 200 | 150 |
| Flying probe | 100 | 100 | |
| Rigid-Flex Technology | Flying probe | Up to 4 w air gap | Up to 4 w air gap |
| Rigid-Flex layer count | Up to 12 | Up to 16 | |
| Max. Rigid-Flex PNL size ( mm ) | ~ 250 x 400 | ~ 500 x 610 | |
| Max. Rigid-Flex PNL size ( mm ) | 25 | 12 | |
| Min rigid layer thickness ( um ) | # 1037 & # 1027 | # 1017 | |
| Surface finishing | ENIG, ENEPIG, Hard Au, OSP | ||
| Packaging & Delivery | |||||
| Packaging Details: | Inner: vacuum packing or Anti-static package, Outer: export carton or according to the customer's requirement. |
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| Port: | Shenzhen or Hongkong | ||||
| Lead Time: | Quantity(Pieces) | 1-10 | 11-100 | 101-1000 | >1000 |
| Est. Time(days) | 3-5 | 3-5 | 7-9 |
To be negotiated |
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FAQ:
Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.
Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.
Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.
Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.
Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.
Q: Are you factory?
FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China
Contact Person: zhengshuangli
Tel: +8618820288062
