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FR-4 4 Layer Security Product PCB Manufacture Custom Circuit Board Maker

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FR-4 4 Layer Security Product PCB Manufacture Custom Circuit Board Maker

FR-4 4 Layer Security Product PCB Manufacture Custom Circuit Board Maker
FR-4 4 Layer Security Product PCB Manufacture Custom Circuit Board Maker FR-4 4 Layer Security Product PCB Manufacture Custom Circuit Board Maker

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Product Details:
Place of Origin: CHINA
Brand Name: FASTPCB
Payment & Shipping Terms:
Minimum Order Quantity: 10PCS
Price: USD 0.01-100/PCS
Packaging Details: Corrugated case
Payment Terms: L/C, T/T
Supply Ability: 25,000 ㎡ / month Or 10PCS/48Hour(Double-Sided Printed Board)Or 10PCS/72Hour(Multilayer printed circuit board )

FR-4 4 Layer Security Product PCB Manufacture Custom Circuit Board Maker

Description
PCB Type: Multilayer Printed Circuit Board Base Material: FR-4
Number Of Layers: 4 Layer Copper Thickness: 1Oz.
Board Thickness: 1.6mm+/-10% Min. Hole Size: 0.2mm
Min. Line Width: 0.1mm(4mil) Min. Line Spacing: 0.1mm(4mil)
Surface Finishing: HASL Solder Mask Color: Green
High Light:

Custom Circuit Board Maker

FR-4 4 Layer Security Product PCB Manufacture 

The FR-4 4 Layer Security Product PCB Manufacture is the rigidity PCB circuit board developed and produced by Shenzhen Quanhong Electronics Co., Ltd. the HDI board is made of FR-4 material, surface gold deposition and laser drilling. The minimum line width and line spacing can reach 75um and the minimum hole diameter can reach 0.1mm. The buried blind hole circuit board is widely used in digital cameras, notebooks, mobile phones and other electronic products and automotive electronics.

product application:

Security products are mainly used in monitoring, anti-theft alarm, traffic safety, security inspection, anti-counterfeiting technology, access control attendance and other security electronic products.

 

HLC Process capability

Item HLC Advanced Technology
2019 2020 2021
Max Panel Width (inch) 25 25 25
Max Panel Length (inch) 29 29 29
Max Layer Count (L) 16 18 36
Max Board thickness (mm) 3.2 4 6
Max Board thickness Tolerance +/-10% +/-10% +/-10%
Base copper Thickness Inner layer ( OZ ) 4 6 8
Outer Layer ( OZ ) 2 3 4
Min DHS ( mm ) 0.2 0.15 0.15
PTH Size Tolerance ( mil ) +/-2 +/-2 +/-2
Back Drill (stub)( mil ) ~ 3 ~ 2.4 ~ 2
Max. AR 12:1 16:1 20:1
Item HLC Advanced Technology
2019 2020 2021
M-drill tolerance Inner layer ( mil ) DHS + 10 DHS + 10 DHS + 8
Outer Layer ( mil ) DHS + 8 DHS + 8 DHS + 6
Solder mask Registration (um) +/- 40 +/- 30 +/- 25
Impedance control ≥50ohms +/-10% +/-10% -/-8%
<50ohms 5 Ω 5 Ω 4 Ω
Min LW/S (Inner)@1oz base Cu ( mil ) 3.0 / 3.0 2.6 / 2.6 2.5 / 2.5
Min LW/S (Outer)@1oz Cu ( mil ) 3.5 / 3.5 3.0 / 3.5 3.0 / 3.0
Max dimple for POFV ( um ) 30 20 15
Surface Finishing ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au

HDI Process capability

Item HDI Advanced Technology
2019 2020 2021
Structure 5+n+5 6+n+6 7+n+7
HDI Stack Via AnyLayer(12L) AnyLayer(14L) AnyLayer(16L)
Board Thickness(mm) Min. 8L 0.45 0.4 0.35
Min. 10L 0.55 0.45 0.4
Min. 12L 0.65 0.6 0.55
MAX.   2.4  
Min. Core Thickness ( um ) 50 40 40
Min. PP Thickness ( um ) 30(#1027PP) 25(#1017PP) 20(#1010PP)
Base Copper Thickness Inner Layer ( OZ) 1/3 ~ 2 1/3 ~ 2 1/3 ~ 2
Outer Layer ( OZ ) 1/3 ~ 1 1/3 ~ 1 1/3 ~ 1
Item HDI Advanced Technology
2019 2020 2021
Min. Mechanical Drill hole size(um) ** 200 200 150
Max. Through Hole Aspect Ratio * 8:1 10:1 10:1
Min. Laser via/Pad Size ( um ) 75/200 70/170 60/150
Max. Laser Via Aspect Ratio 0.8:1 0.8:1 0.8:1
Laser Via on PTH(VOP)design Yes Yes Yes
Laser X type through hole(DT≤200um) NA 60~100um 60~100um
Min. LW/S (L/S/Cu, um) Inner Layer 45 /45 /15 40/ 40/ 15 30/ 30 /15
outer Layer 50 /50/ 20 40 /50 /20 40 /40 /17
Min BGA Pitch (mm)   0.35 0.3 0.3
Item HDI Advanced Technology
2019 2020 2021
Solder mask Registration (um) +/- 30 +/- 25 +/- 20
Min. Solder Mask Dam (mm) 0.07 0.06 0.05
PCB Warpage Control >= 50ohm +/-10% +/-8% +/- 5%
< 50ohm +/- 5ohm +/- 3ohm +/- 3ohm
PCB Warpage Control ≤0.5% ≤0.5% ≤0.5%
cavity Depth accuracy (um) Mechanical +/- 75 +/- 75 +/- 50
Laser directly +/- 50 +/- 50 +/- 50
Surface Finishing OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG

 

Packaging & Delivery
Packaging Details: Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement.
Port: Shenzhen or Hongkong
Lead Time: Quantity(Pieces) 1-10 11-100 101-1000 >1000
  Est. Time(days) 3-5 3-5 7-9 To be negotiated

FAQ:

Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.

 

Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.

 

Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

 

Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.

 

Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.

 

Q: Are you factory?

FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China


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Contact Details
Quanhong FASTPCB

Contact Person: zhengshuangli

Tel: +8618820288062

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