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14 Layer Hdi Technology In Pcb Backdrill Process 2.5mm

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14 Layer Hdi Technology In Pcb Backdrill Process 2.5mm

14 Layer Hdi Technology In Pcb Backdrill Process 2.5mm
14 Layer Hdi Technology In Pcb Backdrill Process 2.5mm

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Product Details:
Brand Name: FASTPCB
Payment & Shipping Terms:
Minimum Order Quantity: 10PCS
Price: USD 0.01-100PCS
Packaging Details: Inner: vacuum packing or Anti-static package, Outer: export carton
Payment Terms: L/C, T/T
Supply Ability: 25,000 ㎡ / month Or 10PCS/48Hour(Double-Sided Printed Board)Or 10PCS/72Hour(Multilayer printed circuit board )

14 Layer Hdi Technology In Pcb Backdrill Process 2.5mm

Description
PCB: 14 Layer Back Drilled HDI Board Base Material: M6
Number Of Layers: 14Layer Board Thickness: 2.5mm+/-10%
Min. Line Width: 0.075mm Inner Layer Spacing: 0.125mm
Min. Hole Size: 0.25mm Special Process: 5 Sets Of Back Drill
High Light:

14 Layer Hdi Technology In Pcbs 2.5mm

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Hdi Technology In Pcbs Backdrill Process 2.5mm

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pcb backdrill 2.5mm

14 Layer Back Drilled HDI Board

The 14 layer back drilling board is one of the HDI PCB circuit boards developed and produced by Shenzhen Quanhong Electronics Co., Ltd. this type of HDI circuit board is made of M6 material, which is drilled and pressed by laser for many times. 14 layer back drilling plate is widely used in communication and other fields.

Rigid PCB Manufacturing Capability

Rigid PCB Manufacturing Capability
Item PCB HDI
Layer 1-40 1-40
Minimum linewidth/linespacing 3MIL/3MIL(0.075mm) 2MIL/2MIL(0.05MM)
Minimum hole diameter 6MIL(0.15MM) 6MIL(0.15MM)
Minimum solder resist opening (single-side) 1.5MIL(0.0375MM) 1.2MIL(0.03MM)
Minimum solder resist bridge 3MIL(0.075MM) 2.2MIL(0.055MM)
Maximum aspect Ratio (thickness/hole diameter) 10:01 8:01
Impedance control accuracy +/-8% +/-8%
Finished thickness 0.3-3.2MM 0.2-3.2MM
Maximum board size 630MM*620MM 620MM*544MM
Maximum finished copper thickness 6OZ(210UM) 2OZ(70UM)
Minimum board thickness 6MIL(0.15MM) 3MIL(0.076MM)
Maximum layer 14层 12层
Surface treatment HASL-LF,OSP ,Immersion Gold, Immersion Tin ,Immersion Ag Immersion Gold,OSP,selectiveimmersion gold,
carbon print
Min/max laser hole size / 3MIL / 9.8MIL
Laser hole size tolerance / 10%

 

Packaging & Delivery
Packaging Details: Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement.
Port: Shenzhen or Hongkong
Lead Time: Quantity(Pieces) 1-10 11-100 101-1000 >1000
  Est. Time(days) 20 21 25 To be negotiated

 

FAQ:

Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.

 

Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.

 

Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

 

Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.

 

Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.

 

Q: Are you factory?

FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China

 

14 Layer Hdi Technology In Pcb Backdrill Process 2.5mm 0

Contact Details
Quanhong FASTPCB

Contact Person: zhengshuangli

Tel: +8618820288062

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