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Enig Electroless Nickel Immersion Gold Pcb Thickness 3.6mm 22 Layer Black

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China Quanhong FASTPCB certification
China Quanhong FASTPCB certification
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Enig Electroless Nickel Immersion Gold Pcb Thickness 3.6mm 22 Layer Black

Enig Electroless Nickel Immersion Gold Pcb Thickness 3.6mm 22 Layer Black
Enig Electroless Nickel Immersion Gold Pcb Thickness 3.6mm 22 Layer Black

Large Image :  Enig Electroless Nickel Immersion Gold Pcb Thickness 3.6mm 22 Layer Black

Product Details:
Place of Origin: CHINA
Brand Name: FASTPCB
Payment & Shipping Terms:
Minimum Order Quantity: 10PCS
Price: USD 0.01-100/PCS
Packaging Details: Corrugated case
Payment Terms: L/C, T/T
Supply Ability: 25,000 ㎡ / month Or 10PCS/48Hour(Double-Sided Printed Board)Or 10PCS/72Hour(Multilayer printed circuit board )

Enig Electroless Nickel Immersion Gold Pcb Thickness 3.6mm 22 Layer Black

Description
PCB Type: 22 Layer Black Immersion Gold Multilayer Printed Circuit Board Base Material: S1000-2M
Number Of Layers: 22 Layer Copper Thickness: 1Oz.
Board Thickness: 3.6mm+/-10% Min. Hole Size: 0.3mm
Min. Line Width: 0.1mm(4mil) Min. Line Spacing: 0.1mm(4mil)
Surface Finishing: ENIG Solder Mask Color: Black
Minimum Plate Thickness Aperture Ratio: 12:1
High Light:

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22 Layer Black Immersion Gold Multilayer Printed Circuit Board

The 22 Layer Black Immersion Gold Multilayer Printed Circuit Board is a multilayer PCB developed and produced by Shenzhen Quanhong Electronics Co., Ltd. It is made of shengyi S1000-2M material and processes such as twice laser, twice pressing and surface gold deposition. The multilayer circuit board is widely used in 5g communication network and artificial intelligence.

HLC Process capability

Item HLC Advanced Technology
2019 2020 2021
Max Panel Width (inch) 25 25 25
Max Panel Length (inch) 29 29 29
Max Layer Count (L) 16 18 36
Max Board thickness (mm) 3.2 4 6
Max Board thickness Tolerance +/-10% +/-10% +/-10%
Base copper Thickness Inner layer ( OZ ) 4 6 8
Outer Layer ( OZ ) 2 3 4
Min DHS ( mm ) 0.2 0.15 0.15
PTH Size Tolerance ( mil ) +/-2 +/-2 +/-2
Back Drill (stub)( mil ) ~ 3 ~ 2.4 ~ 2
Max. AR 12:1 16:1 20:1
Item HLC Advanced Technology
2019 2020 2021
M-drill tolerance Inner layer ( mil ) DHS + 10 DHS + 10 DHS + 8
Outer Layer ( mil ) DHS + 8 DHS + 8 DHS + 6
Solder mask Registration (um) +/- 40 +/- 30 +/- 25
Impedance control ≥50ohms +/-10% +/-10% -/-8%
<50ohms 5 Ω 5 Ω 4 Ω
Min LW/S (Inner)@1oz base Cu ( mil ) 3.0 / 3.0 2.6 / 2.6 2.5 / 2.5
Min LW/S (Outer)@1oz Cu ( mil ) 3.5 / 3.5 3.0 / 3.5 3.0 / 3.0
Max dimple for POFV ( um ) 30 20 15
Surface Finishing ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au

HDI Process capability

Item HDI Advanced Technology
2019 2020 2021
Structure 5+n+5 6+n+6 7+n+7
HDI Stack Via AnyLayer(12L) AnyLayer(14L) AnyLayer(16L)
Board Thickness(mm) Min. 8L 0.45 0.4 0.35
Min. 10L 0.55 0.45 0.4
Min. 12L 0.65 0.6 0.55
MAX.   2.4  
Min. Core Thickness ( um ) 50 40 40
Min. PP Thickness ( um ) 30(#1027PP) 25(#1017PP) 20(#1010PP)
Base Copper Thickness Inner Layer ( OZ) 1/3 ~ 2 1/3 ~ 2 1/3 ~ 2
Outer Layer ( OZ ) 1/3 ~ 1 1/3 ~ 1 1/3 ~ 1
Item HDI Advanced Technology
2019 2020 2021
Min. Mechanical Drill hole size(um) ** 200 200 150
Max. Through Hole Aspect Ratio * 8:1 10:1 10:1
Min. Laser via/Pad Size ( um ) 75/200 70/170 60/150
Max. Laser Via Aspect Ratio 0.8:1 0.8:1 0.8:1
Laser Via on PTH(VOP)design Yes Yes Yes
Laser X type through hole(DT≤200um) NA 60~100um 60~100um
Min. LW/S (L/S/Cu, um) Inner Layer 45 /45 /15 40/ 40/ 15 30/ 30 /15
outer Layer 50 /50/ 20 40 /50 /20 40 /40 /17
Min BGA Pitch (mm)   0.35 0.3 0.3
Item HDI Advanced Technology
2019 2020 2021
Solder mask Registration (um) +/- 30 +/- 25 +/- 20
Min. Solder Mask Dam (mm) 0.07 0.06 0.05
PCB Warpage Control >= 50ohm +/-10% +/-8% +/- 5%
< 50ohm +/- 5ohm +/- 3ohm +/- 3ohm
PCB Warpage Control ≤0.5% ≤0.5% ≤0.5%
cavity Depth accuracy (um) Mechanical +/- 75 +/- 75 +/- 50
Laser directly +/- 50 +/- 50 +/- 50
Surface Finishing OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG
 

 

Packaging & Delivery

Packaging Details:

Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement.

Port:

Shenzhen or Hongkong

Lead Time:

Quantity(Pieces)

1-10

11-100

101-1000

>1000

 

Est. Time(days)

3-5

3-5

7-9

To be negotiated

 

FAQ:

Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.

 

Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.

 

Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.

 

Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.

 

Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.

 

Q: Are you factory?

FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China

Enig Electroless Nickel Immersion Gold Pcb Thickness 3.6mm 22 Layer Black 0
   

   

Contact Details
Quanhong FASTPCB

Contact Person: zhengshuangli

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