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Field Programmable Gate Array High Speed PCB Board Arcade Asic Fpga Pcb Design

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China Quanhong FASTPCB certification
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Field Programmable Gate Array High Speed PCB Board Arcade Asic Fpga Pcb Design

Field Programmable Gate Array High Speed PCB Board Arcade Asic Fpga Pcb Design
Field Programmable Gate Array High Speed PCB Board Arcade Asic Fpga Pcb Design

Large Image :  Field Programmable Gate Array High Speed PCB Board Arcade Asic Fpga Pcb Design

Product Details:
Place of Origin: CHINA
Brand Name: FASTPCB

Field Programmable Gate Array High Speed PCB Board Arcade Asic Fpga Pcb Design

Description
PCB Type: FPGA High Speed Printed Circuit Board Base Material: Shengyi S1000-2M
Number Of Layers: 12 Layer Copper Thickness: 1Oz.
Board Thickness: 5.0mm Min. Hole Size: 0.20mm
Min. Line Width: 0.050mm Min. Line Spacing: 0.075mm
Surface Finishing: Immersion Gold Thickness: 3U " Characteristic 1: Impedance Control
Golden Finger: Hard Gold (5U ") Application Area: Desktop PC Products
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FPGA High Speed Printed Circuit Board

The FPGA High Speed Printed Circuit Board is a high-speed circuit board developed and produced by Shenzhen Quanhong Electronics Co., Ltd. It is made by pure pressing of shengyi S1000-2M high-speed materials, surface gold deposition and other production processes. It is widely used in the field of high-speed computers and high-end servers in cloud data centers. The products have the characteristics of stability and durability.

 

Item HDI Advanced Technology
2019 2020 2021
Structure 5+n+5 6+n+6 7+n+7
HDI Stack Via AnyLayer(12L) AnyLayer(14L) AnyLayer(16L)
Board Thickness(mm) Min. 8L 0.45 0.4 0.35
Min. 10L 0.55 0.45 0.4
Min. 12L 0.65 0.6 0.55
MAX.   2.4  
Min. Core Thickness ( um ) 50 40 40
Min. PP Thickness ( um ) 30(#1027PP) 25(#1017PP) 20(#1010PP)
Base Copper Thickness Inner Layer ( OZ) 1/3 ~ 2 1/3 ~ 2 1/3 ~ 2
Outer Layer ( OZ ) 1/3 ~ 1 1/3 ~ 1 1/3 ~ 1
Item HDI Advanced Technology
2019 2020 2021
Min. Mechanical Drill hole size(um) ** 200 200 150
Max. Through Hole Aspect Ratio * 8:1 10:1 10:1
Min. Laser via/Pad Size ( um ) 75/200 70/170 60/150
Max. Laser Via Aspect Ratio 0.8:1 0.8:1 0.8:1
Laser Via on PTH(VOP)design Yes Yes Yes
Laser X type through hole(DT≤200um) NA 60~100um 60~100um
Min. LW/S (L/S/Cu, um) Inner Layer 45 /45 /15 40/ 40/ 15 30/ 30 /15
outer Layer 50 /50/ 20 40 /50 /20 40 /40 /17
Min BGA Pitch (mm)   0.35 0.3 0.3
Item HDI Advanced Technology
2019 2020 2021
Solder mask Registration (um) +/- 30 +/- 25 +/- 20
Min. Solder Mask Dam (mm) 0.07 0.06 0.05
PCB Warpage Control >= 50ohm +/-10% +/-8% +/- 5%
< 50ohm +/- 5ohm +/- 3ohm +/- 3ohm
PCB Warpage Control ≤0.5% ≤0.5% ≤0.5%
cavity Depth accuracy (um) Mechanical +/- 75 +/- 75 +/- 50
Laser directly +/- 50 +/- 50 +/- 50
Surface Finishing OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG

 

Item HLC Advanced Technology
2019 2020 2021
Max Panel Width (inch) 25 25 25
Max Panel Length (inch) 29 29 29
Max Layer Count (L) 16 18 36
Max Board thickness (mm) 3.2 4 6
Max Board thickness Tolerance +/-10% +/-10% +/-10%
Base copper Thickness Inner layer ( OZ ) 4 6 8
Outer Layer ( OZ ) 2 3 4
Min DHS ( mm ) 0.2 0.15 0.15
PTH Size Tolerance ( mil ) +/-2 +/-2 +/-2
Back Drill (stub)( mil ) ~ 3 ~ 2.4 ~ 2
Max. AR 12:1 16:1 20:1
Item HLC Advanced Technology
2019 2020 2021
M-drill tolerance Inner layer ( mil ) DHS + 10 DHS + 10 DHS + 8
Outer Layer ( mil ) DHS + 8 DHS + 8 DHS + 6
Solder mask Registration (um) +/- 40 +/- 30 +/- 25
Impedance control ≥50ohms +/-10% +/-10% -/-8%
<50ohms 5 Ω 5 Ω 4 Ω
Min LW/S (Inner)@1oz base Cu ( mil ) 3.0 / 3.0 2.6 / 2.6 2.5 / 2.5
Min LW/S (Outer)@1oz Cu ( mil ) 3.5 / 3.5 3.0 / 3.5 3.0 / 3.0
Max dimple for POFV ( um ) 30 20 15
Surface Finishing ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au

 

Item SMT Capability
2019 2020 2021
Min board thickness ( mm ) 0.1 0.06 0.05
Max. board size ( mm ) 200 x 250 250 x 300 250 x 350
Chip component ( L, C, R etc. ) Minimum size 1005 1005 1005
Connector 0.5 mm pitch Y Y Y
0.4 mm pitch Y Y Y
0.35 mm pitch Y Y Y
High density component : 0.5 mm pitch Y Y Y
TSOP, QFP, QFN, LGA, BGA etc. 0.4 mm pitch Y Y Y
  0.35 mm pitch Y Y Y
Reflow N2 reflow No Y Y
Under-fill Fill under chip Manual Auto Auto
ACF attach Gold finger pitch N/A 0.3 mm 0.2 mm
Inspection Component position, direction, missing etc. Manual check with 10 x scope Auto AOI inspection Auto AOI inspection
Solder paste thickness Measure once per shift 1 line auto full area, online SPI All lines auto full area, online SPI

 

Packaging & Delivery

Packaging Details:

Inner: vacuum packing or Anti-static package,
Outer: export carton
or according to the customer's requirement.

Port:

Shenzhen or Hongkong

Lead Time:

Quantity(Pieces)

1-10

11-100

101-1000

>1000

 

Est. Time(days)

3-5

3-5

7-9

To be negotiated

 
 

 
 
FAQ:
Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.
 

Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.
 
Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.
 
Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.
 
Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.
 
Q: Are you factory?
FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China
Field Programmable Gate Array High Speed PCB Board Arcade Asic Fpga Pcb Design 0
   
   

Contact Details
Quanhong FASTPCB

Contact Person: zhengshuangli

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