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Product Details:
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| PCB: | ENIG + Peelable Solder Special Process PCB | Base Material: | KB-6160+ Peelable Solder |
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| Number Of Layers: | 4 Layer | Board Thickness: | 1.2mm |
| Min. Hole Size: | 0.3mm | Min. Line Width: | 0.10mm |
| Min. Line Spacing: | 0.10mm | Solder Mask Color: | Green |
| Surface Treatment: | Immersion Gold | Characteristic 1: | Peelable Solder |
| Copper Thickness: | 1 Oz. | ||
| High Light: | ENIG Special PCB Board,4 Layer Special PCB Board,4 Layer flexible circuit board |
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ENIG + Peelable Solder Special Process PCB
ENIG + Peelable Solder Special Process PCB is a special process printed circuit board developed and produced by Shenzhen Quanhong Electronics Co., Ltd., which is made of FR-4 material and surface gold deposition. The minimum line width and line spacing can reach 75 / 75um and the minimum aperture can reach 0.2mm. The circuit board is widely used in mobile phones, laptops, automobiles, tablet computers and other fields.
HDI Advanced Technology
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Item |
HDI Advanced Technology |
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2019 |
2020 |
2021 |
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Structure |
5+n+5 |
6+n+6 |
7+n+7 |
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HDI Stack Via |
AnyLayer(12L) |
AnyLayer(14L) |
AnyLayer(16L) |
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Board Thickness(mm) |
Min. 8L |
0.45 |
0.4 |
0.35 |
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Min. 10L |
0.55 |
0.45 |
0.4 |
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Min. 12L |
0.65 |
0.6 |
0.55 |
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MAX. |
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2.4 |
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Min. Core Thickness ( um ) |
50 |
40 |
40 |
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Min. PP Thickness ( um ) |
30(#1027PP) |
25(#1017PP) |
20(#1010PP) |
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Base Copper Thickness |
Inner Layer ( OZ) |
1/3 ~ 2 |
1/3 ~ 2 |
1/3 ~ 2 |
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Outer Layer ( OZ ) |
1/3 ~ 1 |
1/3 ~ 1 |
1/3 ~ 1 |
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Item |
HDI Advanced Technology |
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2019 |
2020 |
2021 |
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Min. Mechanical Drill hole size(um) ** |
200 |
200 |
150 |
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Max. Through Hole Aspect Ratio * |
8:1 |
10:1 |
10:1 |
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Min. Laser via/Pad Size ( um ) |
75/200 |
70/170 |
60/150 |
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Max. Laser Via Aspect Ratio |
0.8:1 |
0.8:1 |
0.8:1 |
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Laser Via on PTH(VOP)design |
Yes |
Yes |
Yes |
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Laser X type through hole(DT≤200um) |
NA |
60~100um |
60~100um |
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Min. LW/S (L/S/Cu, um) |
Inner Layer |
45 /45 /15 |
40/ 40/ 15 |
30/ 30 /15 |
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outer Layer |
50 /50/ 20 |
40 /50 /20 |
40 /40 /17 |
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Min BGA Pitch (mm) |
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0.35 |
0.3 |
0.3 |
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Item |
HDI Advanced Technology |
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2019 |
2020 |
2021 |
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Solder mask Registration (um) |
+/- 30 |
+/- 25 |
+/- 20 |
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Min. Solder Mask Dam (mm) |
0.07 |
0.06 |
0.05 |
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PCB Warpage Control |
>= 50ohm |
+/-10% |
+/-8% |
+/- 5% |
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< 50ohm |
+/- 5ohm |
+/- 3ohm |
+/- 3ohm |
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PCB Warpage Control |
≤0.5% |
≤0.5% |
≤0.5% |
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cavity Depth accuracy (um) |
Mechanical |
+/- 75 |
+/- 75 |
+/- 50 |
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Laser directly |
+/- 50 |
+/- 50 |
+/- 50 |
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Surface Finishing |
OSP,ENIG,Immersion Tin,Hard Au, Immersion Ag |
OSP,ENIG,Immersion Tin,Hard Au,Immersion Ag, ENEPIG |
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HLC Advanced Technology
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Item |
HLC Advanced Technology |
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2019 |
2020 |
2021 |
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Max Panel Width (inch) |
25 |
25 |
25 |
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Max Panel Length (inch) |
29 |
29 |
29 |
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Max Layer Count (L) |
16 |
18 |
36 |
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Max Board thickness (mm) |
3.2 |
4 |
6 |
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Max Board thickness Tolerance |
+/-10% |
+/-10% |
+/-10% |
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Base copper Thickness |
Inner layer ( OZ ) |
4 |
6 |
8 |
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Outer Layer ( OZ ) |
2 |
3 |
4 |
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Min DHS ( mm ) |
0.2 |
0.15 |
0.15 |
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PTH Size Tolerance ( mil ) |
+/-2 |
+/-2 |
+/-2 |
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Back Drill (stub)( mil ) |
~ 3 |
~ 2.4 |
~ 2 |
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Max. AR |
12:1 |
16:1 |
20:1 |
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Item |
HLC Advanced Technology |
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2019 |
2020 |
2021 |
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M-drill tolerance |
Inner layer ( mil ) |
DHS + 10 |
DHS + 10 |
DHS + 8 |
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Outer Layer ( mil ) |
DHS + 8 |
DHS + 8 |
DHS + 6 |
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Solder mask Registration (um) |
+/- 40 |
+/- 30 |
+/- 25 |
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Impedance control |
≥50ohms |
+/-10% |
+/-10% |
-/-8% |
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<50ohms |
5 Ω |
5 Ω |
4 Ω |
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Min LW/S (Inner)@1oz base Cu ( mil ) |
3.0 / 3.0 |
2.6 / 2.6 |
2.5 / 2.5 |
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Min LW/S (Outer)@1oz Cu ( mil ) |
3.5 / 3.5 |
3.0 / 3.5 |
3.0 / 3.0 |
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Max dimple for POFV ( um ) |
30 |
20 |
15 |
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Surface Finishing |
ENIG, Immersion Ag, OSP, HASL, Immersion Tin, Hard Au |
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Packaging & Delivery |
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Packaging Details: |
Inner: vacuum packing or Anti-static package, |
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Port: |
Shenzhen or Hongkong |
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Lead Time: |
Quantity(Pieces) |
1-10 |
11-100 |
101-1000 |
>1000 |
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Est. Time(days) |
20 |
21 |
25 |
To be negotiated |
FAQ:
Q: What service do you have?
FASTPCB: We provide turnkey solution including PCB fabrication, SMT, plastic injection & metal,final assembly, testing and other value-added service.
Q: What is needed for PCB & PCBA quotation?
FASTPCB: For PCB: Quantity, Gerber file and technic requirements(material,size, surface finish treatment, copper thickness,board thickness).
For PCB: PCB information, BOM,Testing documents.
Q: How to keep our product information and design file secret ?
FASTPCB: We are willing to sign a NDA effect by customers side local law and promising tokeep customers data in high confidential level.
Q: What are the main products of your PCB/PCBA services?
FASTPCB: Automotive, Medical, Industry Control, IOT, Smart Home, Military, Aerospace.
Q: What is your minimum order quantity (MOQ)?
FASTPCB: Our MOQ is 1 PCS, sample and mass production all can support.
Q: Are you factory?
FASTPCB:Shangxing West Industrial Zone, Xihuan Road, Shajing Street, Bao 'an District, Shenzhen, Guangdong province, China
Contact Person: zhengshuangli
Tel: +8618820288062
