• 6oz Surface Mount PCB Design And Development Assembly Bulk Production
  • 6oz Surface Mount PCB Design And Development Assembly Bulk Production
  • 6oz Surface Mount PCB Design And Development Assembly Bulk Production
  • 6oz Surface Mount PCB Design And Development Assembly Bulk Production
6oz Surface Mount PCB Design And Development Assembly Bulk Production

6oz Surface Mount PCB Design And Development Assembly Bulk Production

Product Details:

Place of Origin: China
Brand Name: HF
Certification: ISO CE
Model Number: customization

Payment & Shipping Terms:

Minimum Order Quantity: 5PCS
Price: Negotiable
Packaging Details: Paper Carton
Delivery Time: 5~8 days
Payment Terms: L/C, T/T,PAYPAL
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Detail Information

Material: FR4 (Shengyi China, ITEQ, KB A+, HZ), HI-TG, FR06, Rogers, Taconic, Argon, Nalco, Isola And So On Board Layers: 1-12
Board Thickness: 0.4-3.2 Copper Thickness: 0.5-4oz
Minimum Hole Size: 0.15mm Minimum Line Width/gap: 3.5/4mil
Solder Mask Color: Green, Yellow,white, Blue,black,red Silkscreen Color: White,black
High Light:

Surface Mount PCB Design And Development

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6oz PCB Design And Development

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Bulk surface mount pcb assembly

Product Description

Capability

 High precision prototypePCB bulk production
Max Layers1-28 layers1-14 layers
MIN Line width(mil)3mil4mil
MIN Line space(mil)3mil4mil
Min via (mechanical drilling)Board thickness≤1.2mm0.15mm0.2mm
Board thickness≤2.5mm0.2mm0.3mm
Board thickness>2.5mmAspect Ration≤13:1Aspect Ration≤13:1
Aspect RationAspect Ration≤13:1Aspect Ration≤13:1
Board thicknessMAX8mm7mm
MIN2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm
MAX Board size610*1200mm610*1200mm
Max copper thickness0.5-6oz0.5-6oz
Immersion Gold/
Gold Plated Thickness
Immersion Gold:Au,1—8u”
Gold finger:Au,1—150u”
Gold Plated:Au,1—150u”
Nickel Plated :50—500u”
 
Hole copper thick25um 1mil25um 1mil
ToleranceBoard thicknessBoard thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%
Board thickness≤1.0mm:+/-0.1mm
1.0mm<Board thickness≤2.0mm:+/-10%
Board thickness>2.0mm:+/-8%
Outline Tolerance≤100mm:+/-0.1mm
100< ≤300mm:+/-0.15mm
>300mm:+/-0.2mm
≤100mm:+/-0.13mm
100< ≤300mm:+/-0.15mm
>300mm:+/-0.2mm
Impedance±10%±10%
MIN Solder mask bridge 0.08mm 0.10mm
Plugging Vias capability 0.25mm--0.60mm 0.70mm--1.00mm

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