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10 Layer High Tg PCB 1oz FR 4 4mil Prepreg High Layer Count PCB
Product Details:
| Place of Origin: | China |
| Brand Name: | HF |
| Certification: | ISO CE |
| Model Number: | multilayer circuit board |
Payment & Shipping Terms:
| Minimum Order Quantity: | 5PCS |
|---|---|
| Price: | Negotiable |
| Packaging Details: | box |
| Delivery Time: | 5~8 days |
| Payment Terms: | L/C, T/T,PAYPAL |
|
Detail Information |
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| Material:: | FR-4 High TG, | Layer Count: | 1-28 |
|---|---|---|---|
| Board Thickness: | 0.4-3.2mm | Copper Thickness: | 1-4oz |
| Solder Color: | Green, Yellow,white, Blue,black,red | Silkscreen Color: | White,black,yellow |
| Surface Finishing: | HASL(lead Free) / Immersion Gold /osp / Immersion Tin/Immersion Silver | Service: | OEM Services Provided,PCB/Components Sourcing/Soldering/Programming/Testing |
| High Light: | hdi circuit boards,led printed circuit board |
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Product Description
10 Layer High Tg PCB 1oz FR 4 4mil Prepreg High Layer Count PCB
PCB data sheets
| PCB SIZE | 97 x 97mm=1PCS |
| BOARD TYPE | |
| Number of Layers | Multilayer PCB, 10 Layer PCB |
| Surface Mount Components | YES |
| Through Hole Components | YES |
| LAYER STACKUP | copper ------- 35um(1oz)+plate TOP Signal |
| 4mil prepreg | |
| copper ------- 18um(0.5oz) GND Plane | |
| 5mil FR-4 | |
| copper ------- 18um(0.5oz) SIG1 | |
| 5mil prepreg | |
| copper ------- 18um(0.5oz) SIG2 | |
| 5mil FR-4 | |
| copper ------- 18um(0.5oz) PWR Plane | |
| 13mil prepreg | |
| copper ------- 18um(0.5oz) GND Plane | |
| 5mil FR-4 | |
| copper ------- 18um(0.5oz) SIG3 | |
| 5mil prepreg | |
| copper ------- 35um(1oz) SIG4 | |
| 5mil FR-4 | |
| copper ------- 35um(1oz) GND Plane | |
| 4mil prepreg | |
| copper ------- 35um(1oz)+plate BOT Signal | |
| TECHNOLOGY | |
| Minimum Trace and Space: | 5.5mil/5mil |
| Minimum / Maximum Holes: | 0.0.5/2.0mm |
| Number of Different Holes: | 2 |
| Number of Drill Holes: | 532 |
| Number of Milled Slots: | 0 |
| Number of Internal Cutouts: | 0 |
| Impedance Control | NO |
| BOARD MATERIAL | |
| Glass Epoxy: | FR-4, ITEQ IT-180, TG>170, er<5.4 |
| Final foil external: | 1.5oz |
| Final foil internal: | 1oz |
| Final height of PCB: | 1.6mm ±0.16 |
| PLATING AND COATING | |
| Surface Finish | Electroless Nickle over Immersion Gold (ENIG)( 1 µ" over 100 µ" nickle) |
| Solder Mask Apply To: | Top and Bottom, 12micon Minimum. |
| Solder Mask Color: | Blue, Kuangshun, KSM-6189BL04 |
| Solder Mask Type: | LPSM |
| CONTOUR/CUTTING | Routing, Fiducial marks |
| MARKING | |
| Side of Component Legend | TOP |
| Colour of Component Legend | White, IJR-4000 MW300, Taiyo Supplied. |
| Manufacturer Name or Logo: | Marked on the board in a conductor and leged FREE AREA |
| VIA | Plated Through Hole(PTH), via tented. |
| FLAMIBILITY RATING | UL 94-V0 Approval MIN. |
| DIMENSION TOLERANCE | |
| Outline dimension: | 0.0059" (0.15mm) |
| Board plating: | 0.0030" (0.076mm) |
| Drill tolerance: | 0.002" (0.05mm) |
| TEST | 100% Electrical Test prior shipment |
| APPLICATION: | Signal processor |
| TYPE OF ARTWORK TO BE SUPPLIED | email file, Gerber RS-274-X, PCBDOC etc |
| SERVICE AREA | Worldwide, Globally. |
Advantages
a) High Tg FR-4 epoxy glass and Prepreg. Industrial standard material with high Tg (175℃ by DSC) and excellent thermal reliability.
b) Lead-Free Assembly Compatible, RoHS compliant and suitable for high thermal reliability needs, and Lead free assemblies with a maximum reflow temperature of 260℃
c) 100% tests inclusive of electrical test and AOI inspection.High voltage test, Impedance control test, micro-section, solder-ability test, thermal stress test, reliability test, insulation resistance test and ionic contamination test etc.
d) Meeting your printed circuit board needs from PCB prototyping to mass volume production.
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