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Aluminum Polyimide PCB HASL FPC Bluetooth Headphones Circuit Board 0.06mm Impedance
Product Details:
| Place of Origin: | China |
| Brand Name: | HF |
| Certification: | ISO CE |
| Model Number: | Flex PCB |
Payment & Shipping Terms:
| Minimum Order Quantity: | 5PCS |
|---|---|
| Price: | Negotiable |
| Packaging Details: | Vacuum packing, high quality carton |
| Delivery Time: | 5~8 days |
| Payment Terms: | L/C, T/T,PAYPAL |
| Supply Ability: | Ten thousand square meters per month |
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Detail Information |
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| Color: | Green,Red,Black,Yellow,White,Blue | Number Of Plies: | 2-4-6-8-10-12-16-20-22-28 Layer |
|---|---|---|---|
| Copper Thickness:: | 1-4oz | Base Material:: | FR4 ,Rogers , Aluminum ,Hight TG |
| Board Thickness:: | 0.6～1.0～1.2～1.6～2.0～2.5～3.0～3.2mm | Place Of Origin:: | Guangdong, China (Mainland) |
| Surface Finishing:: | HASL(lead Free) / Immersion Gold /osp / Immersion Tin/Immersion Silver | Min. Hole Size: | 3mil |
| Service: | OEM Services Provided,PCB/Components Sourcing/Soldering/Programming/Testing..,One-stop Turnkey Service,One Stop Turnkey Service,PCBA | Surface Finishing: | HASL,ENIG,OSP,HASL Lead Free,spray Tin |
| Application: | Electronics Device,ru 94v0 Pcb Printed Circuit Board,Consumer Electronics,rigid Fpc,mobile Usb Charger | ||
| High Light: | polyimide pcb Circuit Board,0.06mm polyimide pcb,Polyimide bluetooth headphones circuit board |
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Product Description
Capability
| High precision prototype | PCB bulk production | ||
| Max Layers | 1-28 layers | 1-14 layers | |
| MIN Line width(mil) | 3mil | 4mil | |
| MIN Line space(mil) | 3mil | 4mil | |
| Min via (mechanical drilling) | Board thickness≤1.2mm | 0.15mm | 0.2mm |
| Board thickness≤2.5mm | 0.2mm | 0.3mm | |
| Board thickness＞2.5mm | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
| Aspect Ration | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
| Board thickness | MAX | 8mm | 7mm |
| MIN | 2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm | 2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm | |
| MAX Board size | 610*1200mm | 610*1200mm | |
| Max copper thickness | 0.5-6oz | 0.5-6oz | |
| Immersion Gold/ Gold Plated Thickness |
Immersion Gold:Au,1—8u” Gold finger:Au,1—150u” Gold Plated:Au,1—150u” Nickel Plated :50—500u” |
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| Hole copper thick | 25um 1mil | 25um 1mil | |
| Tolerance | Board thickness | Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% |
Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% |
| Outline Tolerance | ≤100mm:+/-0.1mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm |
≤100mm:+/-0.13mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm |
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| Impedance | ±10% | ±10% | |
| MIN Solder mask bridge | 0.08mm | 0.10mm | |
| Plugging Vias capability | 0.25mm--0.60mm | 0.70mm--1.00mm | |
Applications:
Communications
Traditional telecommunication equipment, FTTP, VOIP, multimedia services, data networking and IT infrastructure products, wireless infrastructure products, power amplifiers, splitters and combiners, high power transistors, etc.
Computer Peripherals
High end printers, cable modem, wireless routers, IP telephones, consumer and office products, banking system etc.
Consumer
Computers, televisions, cameras, digital video recorders (DVR), handheld products, LED, etc.
Automotive
Passenger safety systems, engine control systems, air bags, traction control products, etc.
High End Computing and Storage
High performance computer and server, mainframe system and storage equipment, memory, etc.
Industry
Power supply, main control panel, monitor, CCTV products,automotive control equipment, industry robot, access control products etc
Medical
Magnetic resonance imaging (MRI), computed tomography (CT), emergency response defibrillation units, patient monitoring, implantable devices, robotic surgery systems, biometrics and diagnostic equipment, etc.
Military
Satellite, radar, airplane, control unit, communication equipment .etc.
Test & Measurement
Power meters, electricity tester, thermal tester, light tester, network tester, gas and oil tester, infrared products, semi-conductor test equipment, DUT and probe cards, wafer inspection systems, etc.