Capability
High precision prototype | PCB bulk production | ||
Max Layers | 1-28 layers | 1-14 layers | |
MIN Line width(mil) | 3mil | 4mil | |
MIN Line space(mil) | 3mil | 4mil | |
Min via (mechanical drilling) | Board thickness≤1.2mm | 0.15mm | 0.2mm |
Board thickness≤2.5mm | 0.2mm | 0.3mm | |
Board thickness>2.5mm | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
Aspect Ration | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
Board thickness | MAX | 8mm | 7mm |
MIN | 2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm | 2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm | |
MAX Board size | 610*1200mm | 610*1200mm | |
Max copper thickness | 0.5-6oz | 0.5-6oz | |
Immersion Gold/ Gold Plated Thickness | Immersion Gold:Au,1—8u” Gold finger:Au,1—150u” Gold Plated:Au,1—150u” Nickel Plated :50—500u” | ||
Hole copper thick | 25um 1mil | 25um 1mil | |
Tolerance | Board thickness | Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% | Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% |
Outline Tolerance | ≤100mm:+/-0.1mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm | ≤100mm:+/-0.13mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm | |
Impedance | ±10% | ±10% | |
MIN Solder mask bridge | 0.08mm | 0.10mm | |
Plugging Vias capability | 0.25mm--0.60mm | 0.70mm--1.00mm |
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