tems | Capacity |
1.Base Material | FR4/High TG FR-4/ Aluminium/CEM-1/Rogers/Arlon/Taconic /Telfon |
2.Layers | 1-40 |
3.Finised inner/outer copper thickness | 1-6OZ |
4.Finished board thickness | 0.2-7.0mm |
5.Min hole size | Mechanical hole: 0.15mm Laser hole: 0.1mm |
6.Controlled Impedance | +/-5% |
7.Plugging vias capability | 0.2-0.8mm |
8.Outline profile | Rout/ V-cut/ Bridge/ Stamp hole |
9.Surface treatment | HASL,HASL lead free,Immersion Gold,Immersion Tin,Immersion Silver,Hard Gold,OSP... |
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