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6 Layer Copper Foil Flexible PCB Fabrication FR4 3mil OEM
Product Details:
| Place of Origin: | China |
| Brand Name: | HF |
| Certification: | ISO CE |
| Model Number: | FPC |
Payment & Shipping Terms:
| Minimum Order Quantity: | 5PCS |
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| Price: | Negotiable |
| Packaging Details: | Vacuum packing, high quality carton |
| Delivery Time: | 5~8 days |
| Payment Terms: | L/C, T/T,PAYPAL |
| Supply Ability: | Ten thousand square meters per month |
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Detail Information |
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| Base Material:: | FR4 ,PI | Layer Count: | 6 |
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| Board Thickness:: | 1.0 | Copper Thickness:: | 2oz |
| Solder Color: | Yellow | Surface Finishing:: | HASL(lead Free) / Immersion Gold /osp |
| Min. Hole Size: | 3mil | Service: | OEM Services Provided,PCB/Components Sourcing/Soldering/Programming/Testing..,One-stop Turnkey Service,One Stop Turnkey Service,PCBA |
| High Light: | 3mil flexible pcb fabrication,Copper Foil flexible pcb fabrication,OEM 6 layer pcb |
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Product Description
Huafu fast multilayer circuit Co., LTD is a professional and reliable one-stop PCB solutions provider for customers specialized in manufacturing quick turn prototypes and small volumes.With high quality and on-time delivery products we won the market's wide acclaim. We will continue to focus on customer satisfaction, along with "high quality "and "fast delivery", we will become a PCB service provider worthy of customer trust.
Our main products are PCB customization and OEM , among which PCB customization products are divided into multi-field PCB, HDI PCB, high frequency and high speed PCB, special PCB.OEM products are divided into multi-field PCBA OEM and component OEM.
Capability
| High precision prototype | PCB bulk production | ||
| Max Layers | 1-28 layers | 1-14 layers | |
| MIN Line width(mil) | 3mil | 4mil | |
| MIN Line space(mil) | 3mil | 4mil | |
| Min via (mechanical drilling) | Board thickness≤1.2mm | 0.15mm | 0.2mm |
| Board thickness≤2.5mm | 0.2mm | 0.3mm | |
| Board thickness＞2.5mm | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
| Aspect Ration | Aspect Ration≤13:1 | Aspect Ration≤13:1 | |
| Board thickness | MAX | 8mm | 7mm |
| MIN | 2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm | 2 layers:0.2mm;4 layers:0.4mm;6 layers:0.6mm;8layers:0.8mm | |
| MAX Board size | 610*1200mm | 610*1200mm | |
| Max copper thickness | 0.5-6oz | 0.5-6oz | |
| Immersion Gold/ Gold Plated Thickness |
Immersion Gold:Au,1—8u” Gold finger:Au,1—150u” Gold Plated:Au,1—150u” Nickel Plated :50—500u” |
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| Hole copper thick | 25um 1mil | 25um 1mil | |
| Tolerance | Board thickness | Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% |
Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% |
| Outline Tolerance | ≤100mm:+/-0.1mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm |
≤100mm:+/-0.13mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm |
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| Impedance | ±10% | ±10% | |
| MIN Solder mask bridge | 0.08mm | 0.10mm | |
| Plugging Vias capability | 0.25mm--0.60mm | 0.70mm--1.00mm | |
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