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HDI PCB Fabrication
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| Place of Origin | China |
| Brand Name | HF |
| Certification | ISO CE |
| Model Number | PCBA |
| 1 | High precision prototype | PCB bulk production |
|
2 |
1-28 layers | 1 layers |
| 3 | 3mil | 2mil |
| 4 | 0.15mm | 1mm |
| 5 | Aspect Ration≤13:1 | Aspect Ration≤13:1 |
| 6 | 2 layers:0.2mm;4 layers:0.35mm;6 layers:0.55mm;8 layers:0.7mm;10 layers:0.9mm | 1 layers |
| 7 | Immersion Gold:Au,1—8u” Gold finger:Au,1—150u” Gold Plated:Au,1—150u” Nickel Plated :50—500u” |
Nickel Plated :50—500u” |
| 8 | Board thickness≤1.0mm:+/-0.1mm 1.0mm<Board thickness≤2.0mm:+/-10% Board thickness>2.0mm:+/-8% |
Board thickness≤1.0mm:+/-0.1mm |
| 9 | ≤100mm:+/-0.1mm 100< ≤300mm:+/-0.15mm >300mm:+/-0.2mm |
≤100mm:+/-0.1mm |
| 10 | ±10% | 10% |
The main advantages
The main advantages of using printed boards are:
1, due to the repeatability (reproducibility) and consistency of the graphics, reduce
the error of wiring and assembly, save the time of equipment maintenance, debugging
and inspection;
2, the design can be standardized, conducive to interchange;
3, high wiring density, small volume, light weight, conducive to the miniaturization
of electronic equipment;
4, conducive to mechanization, automation production, improve labor productivity and
reduce the cost of electronic equipment.
5, FPC flexible board bending resistance, better precision should be to high precision
instruments (such as cameras, mobile phones, video cameras, etc.).
The market situation
In recent decades, China's printed circuit board manufacturing industry has developed
rapidly, and its total output value and output both rank first in the world.Due to the
rapid development of electronic products, the price war has changed the structure of
the supply chain, and China has become the world's most important PCB production base
with industrial distribution, cost and market advantages.
The printed circuit board develops from single layer to double panel, multi layer
board and flexible board, and develops to the direction of high precision, high
density and high reliability continuously.Continuously reduce the size, reduce the
cost, improve the performance, so that the printed circuit board in the future
electronic product development process, still maintain a strong vitality.
The future development trend of printed circuit board manufacturing technology is to
develop in the direction of high density, high precision, fine aperture, fine wire,
small spacing, high reliability, multilayer, high speed transmission, light weight and
thin type.
"China Printed Circuit Board Manufacturing Industry Market Prospect and Investment
Strategy Planning Analysis Report Prospect" survey data show that in 2010, China's
printed circuit board manufacturing enterprises above designated size total 908, total
assets of 216.176 billion yuan;Sales revenue reached 225.796 billion yuan, with a
year-on-year increase of 29.16%;The total profit was 9.403 billion yuan, up 50.08%
year on year.
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